-
WikiChip
WikiChip
-
Architectures
Popular x86
-
Intel
- Client
- Server
- Big Cores
- Small Cores
-
AMD
Popular ARM
-
ARM
- Server
- Big
- Little
-
Cavium
-
Samsung
-
-
Chips
Popular Families
-
Ampere
-
Apple
-
Cavium
-
HiSilicon
-
MediaTek
-
NXP
-
Qualcomm
-
Renesas
-
Samsung
-
From WikiChip
Difference between revisions of "Template:packages/freescale/te-pbga-561"
(Created page with "<table style="border: solid 1px #709fea; width: 100%; margin: 1px;"> <tr><th>'''Package'''</th><td>package::TE-PBGA-561 (TE PBGA)<br>Temperature-Enhanced Plastic BGA</td><...") |
(No difference)
|
Revision as of 22:56, 29 October 2017
Package | TE-PBGA-561 (TE PBGA) Temperature-Enhanced Plastic BGA |
---|---|
Dimension | 23 mm x 23 mm |
Pitch | 0.8 mm |
Pins | 561 |