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Difference between revisions of "Template:finfet nodes comp"

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Revision as of 03:45, 5 April 2017

 
Process Name
1st Production
Litho-
graphy 		Lithography
Immersion
Exposure
Wafer Type
Size
Tran-
sistor 		Type
Voltage
 
Fin Pitch
Width
Height
Gate Length (Lg)
Contacted Gate Pitch (CPP)
Minimum Metal Pitch (MMP)
SRAM
bitcell 		High-Perf (HP)
High-Density (HD)
Low-Voltage (LV)
DRAM
bitcell 		eDRAM
Value
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