From WikiChip
Difference between revisions of "Template:finfet nodes comp"
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{| class="wikitable" style="margin:0; {{{style|}}}" | {| class="wikitable" style="margin:0; {{{style|}}}" | ||
|- style="text-align: center;" | |- style="text-align: center;" | ||
− | ! colspan="2" | {{{process 1 fab|}}} || colspan="2" | {{{process 2 fab|}}} || colspan="2" | {{{process | + | ! colspan="2" | {{{process 1 fab|}}}<!-- |
+ | -->{{#if: {{{process 2 fab|}}}| {{!}}{{!}} colspan="2" {{!}} {{{process 2 fab|}}} }}<!-- | ||
+ | -->{{#if: {{{process 3 fab|}}}| {{!}}{{!}} colspan="2" {{!}} {{{process 3 fab|}}} }}<!-- | ||
+ | -->{{#if: {{{process 4 fab|}}}| {{!}}{{!}} colspan="2" {{!}} {{{process 4 fab|}}} }}<!-- | ||
+ | -->{{#if: {{{process 5 fab|}}}| {{!}}{{!}} colspan="2" {{!}} {{{process 5 fab|}}} }} | ||
|- style="text-align: center;" | |- style="text-align: center;" | ||
| colspan="2" | {{{process 1 name|}}} || colspan="2" | {{{process 2 name|}}} || colspan="2" | {{{process 3 name|}}} | | colspan="2" | {{{process 1 name|}}} || colspan="2" | {{{process 2 name|}}} || colspan="2" | {{{process 3 name|}}} |
Revision as of 01:31, 5 April 2017
Process Name | |
---|---|
1st Production | |
Lithography | Lithography |
Immersion | |
Exposure | |
Wafer | Type |
Size | |
Transistor | Type |
Voltage | |
Fin | Pitch |
Width | |
Height | |
Gate Length (Lg) | |
Contacted Gate Pitch (CPP) | |
Minimum Metal Pitch (MMP) | |
SRAM bitcell | High-Perf (HP) |
High-Density (HD) | |
Low-Voltage (LV) | |
DRAM bitcell | eDRAM |
Value | Value | Value | |||
---|---|---|---|---|---|