Semiconductor & Computer Engineering
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Information for "amd/packages/fp2"
Basic information
| Display title | Package FP2 - AMD |
| Default sort key | Package FP2, AMD |
| Page length (in bytes) | 4,607 |
| Page ID | 36270 |
| Page content language | English (en) |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 0 |
| Counted as a content page | Yes |
| Number of subpages of this page | 0 (0 redirects; 0 non-redirects) |
Page protection
| Edit | Allow all users (infinite) |
| Move | Allow all users (infinite) |
Edit history
| Page creator | QuietRub (talk | contribs) |
| Date of page creation | 12:18, 8 September 2020 |
| Latest editor | QuietRub (talk | contribs) |
| Date of latest edit | 23:21, 25 March 2023 |
| Total number of edits | 3 |
| Total number of distinct authors | 1 |
| Recent number of edits (within past 90 days) | 0 |
| Recent number of distinct authors | 0 |
Page properties
| Transcluded templates (12) | Templates used on this page:
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Facts about "Package FP2 - AMD"
| designer | AMD + |
| first launched | May 15, 2012 + |
| instance of | package + |
| market segment | Mobile + and Embedded + |
| microarchitecture | Piledriver + |
| name | Package FP2 + |
| package | BGA-827 + and FP2 + |
| package contacts | 827 + |
| package length | 31 mm (3.1 cm, 1.22 in) + |
| package pitch | 0.8 mm (0.0315 in) + |
| package type | Organic Micro Ball Grid Array + |
| package width | 27 mm (2.7 cm, 1.063 in) + |
| tdp | 25 W (25,000 mW, 0.0335 hp, 0.025 kW) + |
