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Editing wafer size
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− | + | '''Wafer size''' refers to the diameter of a [[wafer]] and is an important parameter as part of the [[semiconductor manufacturing process]]. A larger wafer size enables the fabrication of more dice per wafer which translates into cost reduction in high-volume manufacturing. | |
== Motivation and difficulties == | == Motivation and difficulties == | ||
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| 1981 || 125 mm || 625 µm | | 1981 || 125 mm || 625 µm | ||
|- | |- | ||
− | | 1983 || 150 mm | + | | 1983 || 150 mm || 675 µm |
|- | |- | ||
− | | 1992 || 200 mm | + | | 1992 || 200 mm || 725 µm |
|- | |- | ||
− | | 2002 || 300 mm | + | | 2002 || 300 mm || 775 µm |
|- | |- | ||
− | | ~ | + | | ~2020 || 450 mm || ~925 µm |
|} | |} | ||
− | Note that wafers grown using materials other than silicon have different thicknesses than a silicon wafer due to the different stress and strain properties. Wafers must be | + | Note that wafers grown using materials other than silicon have different thicknesses than a silicon wafer due to the different stress and strain properties. Wafers must be tick enough to maintain structural integrity during processing and handling. |
== References == | == References == | ||
{{reflist}} | {{reflist}} |