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Editing thruchip interface
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Compared to [[through-silicon via]], TCI can offer considerably higher bandwidth at lower power, less area, and at much lower costs. The power and cost come from the fact that TCI, unlike TSV, uses the base CMOS process unmodified without any added steps. | Compared to [[through-silicon via]], TCI can offer considerably higher bandwidth at lower power, less area, and at much lower costs. The power and cost come from the fact that TCI, unlike TSV, uses the base CMOS process unmodified without any added steps. | ||
− | TCI | + | {| class="wikitable" |
+ | ! | ||
+ | ! TCI !! TSV !! LPDDR4 | ||
+ | |- | ||
+ | | I/O || x44 || x256 || x64 | ||
+ | |- | ||
+ | | Rate || 8 Gbps || 1.1 Gbps || 4.3 Gbps | ||
+ | |- | ||
+ | | Area || -3% || +5% || 0% | ||
+ | |- | ||
+ | | Process Cost || 0% || As much as +25% || 0% | ||
+ | |- | ||
+ | | Power || 1/5X || 1/4X || 1X | ||
+ | |} | ||
== Operation == | == Operation == |