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{{title|Technology Node}}{{lithography processes}} | {{title|Technology Node}}{{lithography processes}} | ||
− | The '''technology node''' (also '''process node''', '''process technology''' or simply '''node''') refers to a specific [[semiconductor manufacturing process]] and its design rules. Different nodes often imply different circuit generations and architectures. Generally, the smaller the technology node means the smaller the feature size, producing smaller transistors which are both faster and more power-efficient. Historically, the process node name | + | The '''technology node''' (also '''process node''', '''process technology''' or simply '''node''') refers to a specific [[semiconductor manufacturing process]] and its design rules. Different nodes often imply different circuit generations and architectures. Generally, the smaller the technology node means the smaller the feature size, producing smaller transistors which are both faster and more power-efficient. Historically, the process node name refered to a number of different features of a transistor including the [[gate length]] as well as M1 half-pitch. Most recently, due to various marketing and discrepancies among foundries, the number itself has lost the exact meaning it once held. Recent technology nodes such as [[22 nm]], [[16 nm]], [[14 nm]], and [[10 nm]] refer purely to a specific generation of chips made in a particular technology. It does not correspond to any gate length or half pitch. Nevertheless the name convention has stuck and it's what the leading foundries call their nodes. |
− | + | In 2017 node names has been entirely overtaken by marketing, both [[Samsung]] and [[TSMC]] started calling each of their enhanced nodes new names - regardless of whether or not the node has had any kind of transistor shrink or [[BEOL]] scaling. Various enhancements have been announced: "12nm" ([[16 nm]] enhancement), "9nm", "8nm", "7nm", "6nm" ([[10 nm]]/[[7 nm]] [[DUV]]/[[EUV]] variants). [[Intel]] also introduces new enhanced processes nodes but they maintain a consistent naming scheme (e.g., "14nm", "14nm+", "14nm++") while reserving the 'common' node names for actual 0.7x shrinks (e.g., "14nm", "10nm", "7nm"). | |
== Nomenclature == | == Nomenclature == | ||
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== Leading edge trend == | == Leading edge trend == | ||
− | As shrinking becomes more complex, requiring more capital, expertise, and resources, the number of companies capable of providing leading edge fabrication has been steadily dropping. As of | + | As shrinking becomes more complex, requiring more capital, expertise, and resources, the number of companies capable of providing leading edge fabrication has been steadily dropping. As of 2017, only four companies are now capable of fabricating [[integrated circuits]] on the most cutting edge process: [[Intel]], [[Samsung]], [[TSMC]], and [[GlobalFoundries]]. |
{| class="wikitable" style="text-align: center;" | {| class="wikitable" style="text-align: center;" | ||
− | ! colspan="11" | Number of | + | ! colspan="11" | Number of Foundries with a Cutting Edge Logic Fab |
− | |- style="vertical-align: bottom | + | |- style="vertical-align: bottom;" |
| | | | ||
[[SilTerra]]<br> | [[SilTerra]]<br> | ||
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[[Hitachi]]<br> | [[Hitachi]]<br> | ||
[[Cypress]]<br> | [[Cypress]]<br> | ||
− | |||
[[Sony]]<br> | [[Sony]]<br> | ||
[[Infineon]]<br> | [[Infineon]]<br> | ||
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[[Freescale]]<br> | [[Freescale]]<br> | ||
[[Renesas]] (NEC)<br> | [[Renesas]] (NEC)<br> | ||
+ | [[SMIC]]<br> | ||
[[Toshiba]]<br> | [[Toshiba]]<br> | ||
[[Fujitsu]]<br> | [[Fujitsu]]<br> | ||
[[TI]]<br> | [[TI]]<br> | ||
[[Panasonic]]<br> | [[Panasonic]]<br> | ||
+ | [[UMC]]<br> | ||
[[STMicroelectronics]]<br> | [[STMicroelectronics]]<br> | ||
− | |||
[[IBM]]<br> | [[IBM]]<br> | ||
− | |||
− | |||
[[AMD]]<br> | [[AMD]]<br> | ||
[[Samsung]]<br> | [[Samsung]]<br> | ||
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Hitachi<br> | Hitachi<br> | ||
Cypress<br> | Cypress<br> | ||
− | |||
Sony<br> | Sony<br> | ||
Infineon<br> | Infineon<br> | ||
Sharp<br> | Sharp<br> | ||
Freescale<br> | Freescale<br> | ||
− | Renesas<br> | + | Renesas (NEC)<br> |
+ | SMIC<br> | ||
Toshiba<br> | Toshiba<br> | ||
Fujitsu<br> | Fujitsu<br> | ||
TI<br> | TI<br> | ||
Panasonic<br> | Panasonic<br> | ||
− | + | UMC<br> | |
− | + | STMicroelectronics<br> | |
IBM<br> | IBM<br> | ||
− | |||
− | |||
AMD<br> | AMD<br> | ||
Samsung<br> | Samsung<br> | ||
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Intel | Intel | ||
| | | | ||
− | |||
Cypress<br> | Cypress<br> | ||
− | |||
Sony<br> | Sony<br> | ||
Infineon<br> | Infineon<br> | ||
Sharp<br> | Sharp<br> | ||
Freescale<br> | Freescale<br> | ||
− | Renesas<br> | + | Renesas (NEC)<br> |
+ | SMIC<br> | ||
Toshiba<br> | Toshiba<br> | ||
Fujitsu<br> | Fujitsu<br> | ||
TI<br> | TI<br> | ||
Panasonic<br> | Panasonic<br> | ||
− | + | UMC<br> | |
− | <br> | + | STMicroelectronics<br> |
IBM<br> | IBM<br> | ||
− | |||
− | |||
AMD<br> | AMD<br> | ||
Samsung<br> | Samsung<br> | ||
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Intel | Intel | ||
| | | | ||
− | Renesas<br> | + | Renesas (NEC)<br> |
+ | SMIC<br> | ||
Toshiba<br> | Toshiba<br> | ||
Fujitsu<br> | Fujitsu<br> | ||
TI<br> | TI<br> | ||
Panasonic<br> | Panasonic<br> | ||
− | + | UMC<br> | |
− | + | STMicroelectronics<br> | |
IBM<br> | IBM<br> | ||
− | |||
− | |||
[[GlobalFoundries]]<br> | [[GlobalFoundries]]<br> | ||
Samsung<br> | Samsung<br> | ||
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Intel | Intel | ||
| | | | ||
− | Renesas<br> | + | Renesas (NEC)<br> |
+ | SMIC<br> | ||
Toshiba<br> | Toshiba<br> | ||
Fujitsu<br> | Fujitsu<br> | ||
TI<br> | TI<br> | ||
Panasonic<br> | Panasonic<br> | ||
− | + | UMC<br> | |
− | + | STMicroelectronics<br> | |
IBM<br> | IBM<br> | ||
− | + | GlobalFoundries<br> | |
− | |||
− | |||
Samsung<br> | Samsung<br> | ||
TSMC<br> | TSMC<br> | ||
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| | | | ||
Panasonic<br> | Panasonic<br> | ||
− | + | UMC<br> | |
− | + | STMicroelectronics<br> | |
IBM<br> | IBM<br> | ||
− | + | GlobalFoundries<br> | |
− | |||
− | |||
Samsung<br> | Samsung<br> | ||
TSMC<br> | TSMC<br> | ||
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| | | | ||
IBM<br> | IBM<br> | ||
− | + | GlobalFoundries<br> | |
− | |||
− | |||
Samsung<br> | Samsung<br> | ||
TSMC<br> | TSMC<br> | ||
Intel | Intel | ||
| | | | ||
− | + | GlobalFoundries<br> | |
− | |||
− | |||
− | |||
Samsung<br> | Samsung<br> | ||
TSMC<br> | TSMC<br> | ||
Intel | Intel | ||
| | | | ||
− | |||
Samsung<br> | Samsung<br> | ||
TSMC<br> | TSMC<br> | ||
Intel | Intel | ||
| | | | ||
+ | GlobalFoundries<br> | ||
Samsung<br> | Samsung<br> | ||
TSMC<br> | TSMC<br> | ||
Intel | Intel | ||
| | | | ||
− | + | Future | |
− | |||
− | |||
|- | |- | ||
| [[180 nm]] | | [[180 nm]] | ||
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| [[5 nm]] | | [[5 nm]] | ||
|} | |} | ||
− | |||
− |