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{{title|Thermal Design Power (TDP)}} | {{title|Thermal Design Power (TDP)}} | ||
− | '''Thermal Design Power''' ('''TDP''') the | + | '''Thermal Design Power''' ('''TDP''') is the amount of [[thermal power]] an [[integrated circuit]] generates under T<sub>CASE,MAX</sub>. A TDP of an IC represents that upper point of the thermal profile and is used for determining the appropriate thermal solution design target. TDP is a measure of heat and should not be confused with [[power dissipation]] which is a measure of the rate of [[work]]. |
== Overview == | == Overview == | ||
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== Thermal Capacitance == | == Thermal Capacitance == | ||
[[File:sandy bridge dynamic thermal capacitance.png|right|400px]] | [[File:sandy bridge dynamic thermal capacitance.png|right|400px]] | ||
− | If an integrated circuit has been running at relatively cooler temperatures, the various materials such as the heatsink have also cooled. This mean that there is a small amount of time whereby it is possible for the IC to effectively exceed the rated amount of heat generated and have the heatsink quickly absorb this heat while still maintaining the rated TDP. | + | If an integrated circuit has been running at relatively cooler temperatures, the various materials such as the heatsink have also cooled. This mean that there is a small amount of time whereby it is possible for the IC to effectively exceed the rated amount of heat generated and have the heatsink quickly absorb this heat while still maintaining the rated TDP. Since {{intel|Sandy Bridge (Client)|Sandy Bridge|l=arch}}, Intel has switch to a dynamic thermal capacitance model which allows their chip to take advantage of this short amount of time at run hotter and at {{intel|turbo boost technology|higher frequency}} in order to extract additional performance. |
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