Editing single diffusion break

{{title|Single Diffusion Break (SDB)}}
'''Single Diffusion Break''' ('''SDB''') or '''Single Dummy Gate''' ('''SDG''') is a semiconductor process flow technique that eliminates the need for an additional dummy gate padding at the cell boundaries. SDB is [[scaling booster|used to enable aggressive scaling]] of abutting cells without affecting the cell height or underlying devices.

==Overview==
Double [[diffusion break]] (DDB) isolation has historically been used to isolate neighboring devices in order to provide good process control (stress) and reduce [[process variability|variations]]. With advancements in [[DTCO]], advanced [[process nodes]] reduced [[cell height]], thereby increasing the share of wasted space due to cell-to-cell spacings as a result of DDB. Single diffusion break reduces the cell-to-cell spacing by reducing the width of the [[shallow trench isolation]] to a single dummy [[poly gate]] [[gate length|length]]. In practice, there is no actual dummy gate. Instead, just the trench isolation remains.

:[[File:ttt-cell-scaling-sdb.svg|800px]]

==Industry==
[[File:iedm-2017-intel-10-wire-hs.png|thumb|right|Intel 10nm SDG benefits.]]
===Samsung===
Samsung first introduced single diffusion breaks at their [[Samsung 14nm|14-nanometer process]]. Samsung used SDB in all their succeeding nodes including [[samsung 10nm|10nm]], [[samsung 7nm|7nm]], [[samsung 5nm|5nm]], and [[samsung 4nm|4nm]].

===Intel===
Intel introduced single diffusion breaks starting with their [[Intel 10nm|10-nanometer process]]. The company claimed SDG resulted in a 20% improvement in [[standard cell|cell]] densty. Intel introduced 2nd-generation SDG at their [[Intel 4]] node.
{| class="right"
| [[File:iedm-2017-intel-10-dummy-gates-tem.png|thumb|200px|[[Intel 10nm]] With DDB.]]
| [[File:iedm-2017-intel-10-sdg-tem.png|thumb|200px|[[Intel 10nm]] With SDB.]]
|}

==TSMC==
{{empty section}}

== See also ==
* [[Scaling boosters]]

== Bibliography ==
* {{bib|iedm|2017|Intel}}

[[category:transistor gate]]
[[category:front-end-of-line device fabrication]]