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Editing self-aligned contact

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Following their standard process for forming the metal gate and after it has been planarized, the gate is recessed back. The silicon nitride etch stop is then deposited and planarized forming an isolation layer followed by a capping oxide layer. Finally, the contact etching can then follow, allowing contacts to land directly on the gate without causing a shot.
 
Following their standard process for forming the metal gate and after it has been planarized, the gate is recessed back. The silicon nitride etch stop is then deposited and planarized forming an isolation layer followed by a capping oxide layer. Finally, the contact etching can then follow, allowing contacts to land directly on the gate without causing a shot.
  
:[[File:cpp sac flow.svg|1200px]]
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:[[File:cpp sac flow.svg|1200px|Intel's SAC Flow.]]
 
 
 
 
The TEM below, taken by [[Intel]], shows contacts that were intentionally overlaid on the gate, demonstrating the contacts can land on or near the gate due to misalignment and still work as desired.
 
 
 
 
 
<gallery widths=350px heights=350px>
 
File:intel 22nm sac.png
 
File:intel 22nm sac (annotated).png
 
</gallery>
 
  
  

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