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− | [[File:intel foveros slide 1.png| | + | [[File:intel foveros slide 1.png|left|thumb|Foveros]] |
First introduced in 2019, Foveros is an advanced 3D face-to-face die stacking packaging process technology. The technology is designed to incorporate two or more [[chiplets]] assembled together. It comprises a base logic die on top of which sit additional active components such as another logic die, memory, FPGA, or even analog/RF. | First introduced in 2019, Foveros is an advanced 3D face-to-face die stacking packaging process technology. The technology is designed to incorporate two or more [[chiplets]] assembled together. It comprises a base logic die on top of which sit additional active components such as another logic die, memory, FPGA, or even analog/RF. | ||