Editing hybrid bonding

{{title|Hybrid Bonding}}{{packaging}}
'''Hybrid Bonding Interconnect''' ('''HBI''') or '''Direct Bond Interconnect''' ('''DBI''') is a high-performance high-density [[vertical signaling|vertical]] die-to-die [[interconnect]] technology used to transmit signal and power between multiple stacked dies through the direct attachment of two homogeneous surfaces forming strong covalent bonds.
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	{{title\|Hybrid Bonding}}{{packaging}}		{{title\|Hybrid Bonding}}{{packaging}}
−	'''Hybrid Bonding Interconnect''' (~~'''HB''' or~~ '''HBI''') or '''Direct Bond Interconnect''' ('''DBI''') is a high-performance high-density [[vertical signaling\|vertical]] die-to-die [[interconnect]] technology used to transmit signal and power between multiple stacked dies through the direct attachment of two homogeneous surfaces forming strong covalent bonds.	+	'''Hybrid Bonding Interconnect''' ('''HBI''') or '''Direct Bond Interconnect''' ('''DBI''') is a high-performance high-density [[vertical signaling\|vertical]] die-to-die [[interconnect]] technology used to transmit signal and power between multiple stacked dies through the direct attachment of two homogeneous surfaces forming strong covalent bonds.