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{{hisilicon title|Kunpeng (Hi16xx)}}
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{{hisilicon title|Hi16xx}}
 
{{ic family
 
{{ic family
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| title            = Kunpeng
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| title            = Hi16xx
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| image            = hi1616 (front).png
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| image            =  
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| caption          = Hi1616 Chip
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| caption          =  
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| no image          = Yes
 
| developer        = HiSilicon
 
| developer        = HiSilicon
 
| developer 2      = ARM Holdings
 
| developer 2      = ARM Holdings
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| socket 2          =  
 
| socket 2          =  
 
}}
 
}}
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'''Kunpeng''' ('''Hi16xx''') is a family of {{arch|64}} [[ARM]] multi-core server SoCs designed for [[Huawei]] line of enterprise ARM servers.
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'''Hi16xx''' is a series of {{arch|64}} [[ARM]] server SoCs designed for [[Huawei]] line of enterprise ARM servers.
  
 
== Overview ==
 
== Overview ==
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[[File:kunpeng roadmap (2019).jpeg|right|thumb|Roadmap]]
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Hi16xx is a series of {{arch|64}} [[ARM]] server microprocessors designed by [[Huawei]]. First introduced in 2015, those processors are geared towards highly-threaded or high-throughput applications. Those processors are only found in the HiSilicon evaluation development boards and in a few limited series of Huawei servers.
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Kunpeng, also known as Hi16xx, is a series of {{arch|64}} [[ARM]] server microprocessors designed by [[Huawei]]. First introduced in 2015, those processors are geared towards highly-threaded or high-throughput applications. Those processors were only found in the HiSilicon evaluation development boards and in a few limited series of Huawei servers. Huawei expanded their server offerings in 2018 and 2019 with the TaiShan line of servers. In early 2019, with the introduction of the 920 series, Huawei rebranded the series as the Kunpeng.
 
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=== Naming scheme ===
 
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:[[File:huawei kunpeng naming scheme.svg|600px]]
 
  
 
== Models ==
 
== Models ==
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=== Older models ===
 
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Older models were based on [[Arm's]] mobile [[Cortex]] cores. Those models range from [[16 cores|16]] to [[32 cores]] and offer up to four memory channels.
 
 
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<table class="comptable sortable tc4">
 
<table class="comptable sortable tc4">
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{{comp table header|main|5:List of Older Hi16xx Processors}}
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{{comp table header|main|5:List of Hi16xx Processors}}
 
{{comp table header|main|5:Main processor}}
 
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{{comp table header|cols|Launched|Cores|Arch|%Frequency|L3}}
 
{{comp table header|cols|Launched|Cores|Arch|%Frequency|L3}}
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{{#ask: [[Category:microprocessor models by hisilicon]] [[family::Hi16xx]] [[first launched::< 2018]]
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{{#ask: [[Category:microprocessor models by hisilicon]] [[family::Hi16xx]]
 
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{{comp table count|ask=[[Category:microprocessor models by hisilicon]] [[family::Hi16xx]] [[first launched::< 2018]]}}
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{{comp table count|ask=[[Category:microprocessor models by hisilicon]] [[family::Hi16xx]]}}
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</table>
 
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=== 920 Series ===
 
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{{see also|hisilicon/microarchitectures/taishan v110|l1=Taishan v110 microarchitecture}}
 
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[[File:hi1620 exhibit sign.jpg|right|thumb|Hi1620 on exhibit.]]
 
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In late 2018, Huawei announced the Kunpeng 920 series, also known as the Hi1620. Manufactured on [[TSMC]]'s [[7 nm process]], those processors are based on the company's custom-designed {{hisilicon|Taishan v110|l=arch}} ARMv 8.2 cores operating at up to 2.6 GHz. All models support up to eight channels of DDR4 memory and up to four-way SMP.
 
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* '''Proc:''' [[7 nm process]]
 
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* '''ISA:''' [[ARMv8.2]]
 
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* '''TDP:''' 100 W - 200 W
 
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* '''Mem:''' Octa-channel DDR4-2933 memory
 
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* '''I/O:''' x40 PCIe Gen 4 with [[CCIX]] support, 2x 100GbE, RoCEv2, 4x USB 3.0, x16 SAS 3.0, 2x SATA 3.0
 
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{{comp table start}}
 
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<table class="comptable sortable tc4">
 
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{{comp table header|main|6:List of Hi1620 Processors}}
 
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{{comp table header|cols|Launched|Cores|Arch|%Frequency|L3|TDP}}
 
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{{#ask: [[Category:microprocessor models by hisilicon]] [[family::Hi16xx]] [[series::920]]
 
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|?model number
 
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|?first launched
 
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|?core count
 
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|?core name
 
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|?base frequency#GHz
 
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|?l3$ size
 
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|?tdp
 
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{{comp table count|ask=[[Category:microprocessor models by hisilicon]] [[family::Hi16xx]] [[series::920]]}}
 
 
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=== 930 Series ===
 
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[[File:hislicon kunpeng roadmap to 930.png|thumb|right|Kunpeng 930 Roadmap]]
 
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Next-generation SoCs are the Hi1630 which are branded as Kunpeng 930 series. Those chips are expected to feature a higher-performance core with higher frequencies, simultaneous multithreading support, and Arm’s {{arm|Scalable Vector Extension}} (SVE) extension. Those chips will are also planned to move to DDR5 memory.
 
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=== 950 Series ===
 
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The Kunpeng 950 series will be the follow-up to the 930 and are planned for the 2023 timeframe.
 
  
 
== See also ==
 
== See also ==

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Facts about "Kunpeng (Hi16xx) - HiSilicon"
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designerHiSilicon + and ARM Holdings +
first announced2014 +
full page namehisilicon/kunpeng +
instance ofsystem on a chip family +
instruction set architectureARM +
main designerHiSilicon +
manufacturerTSMC +
nameKunpeng +
technologyCMOS +
word size64 bit (8 octets, 16 nibbles) +