Semiconductor & Computer Engineering
From WikiChip
Editing die
Warning: You are not logged in. Your IP address will be publicly visible if you make any edits. If you log in or create an account, your edits will be attributed to your username, along with other benefits.
The edit can be undone.
Please check the comparison below to verify that this is what you want to do, and then save the changes below to finish undoing the edit.
This page supports semantic in-text annotations (e.g. "[[Is specified as::World Heritage Site]]") to build structured and queryable content provided by Semantic MediaWiki. For a comprehensive description on how to use annotations or the #ask parser function, please have a look at the getting started, in-text annotation, or inline queries help pages.
| Latest revision | Your text | ||
| Line 5: | Line 5: | ||
== Overview == | == Overview == | ||
| − | The | + | The die is the final product of the [[fabrication process]]. A fully processed wafer will under [[singulation]] following [[wafer probing|probing]]. Depending on the application, the die may be shipped to an assembly/packaging plant where it will undergo [[encapsulation]], producing the final chip that ships to customers. |
=== Known good die === | === Known good die === | ||
{{main|known good die|l1=Known Good Die (KGD)}} | {{main|known good die|l1=Known Good Die (KGD)}} | ||
| − | A '''[[known good die]]''' | + | A '''[[known good die]]''' is a special type of bare die that underwent additional testing and screening post-[[singulation]]. KGD testing ensures the die meets the required specification prior to getting packaged. KGDs are especially important in [[multi-chip packages]] where multiple dies in a single package must function correctly to produce the required product. |
== Die size == | == Die size == | ||
| − | |||
Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single [[wafer]], the die size is a strong indicator of cost. | Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single [[wafer]], the die size is a strong indicator of cost. | ||
| Line 21: | Line 20: | ||
|- style="vertical-align: top;" | |- style="vertical-align: top;" | ||
| | | | ||
| − | |||
* 815 mm² (GV100) | * 815 mm² (GV100) | ||
* 754 mm² (TU102) | * 754 mm² (TU102) | ||
| − | |||
* 610 mm² (GP100) | * 610 mm² (GP100) | ||
* 601 mm² (GM200) | * 601 mm² (GM200) | ||
* 596 mm² (Fiji) | * 596 mm² (Fiji) | ||
* 576 mm² (GT200) | * 576 mm² (GT200) | ||
| − | * | + | * 56 mm²1 (GK110) |
* 545 mm² (TU104) | * 545 mm² (TU104) | ||
* 510 mm² (Vega 10) | * 510 mm² (Vega 10) | ||