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Editing die
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== Overview == | == Overview == | ||
− | The | + | The die is the final product of the [[fabrication process]]. A fully processed wafer will under [[singulation]] following [[wafer probing|probing]]. Depending on the application, the die may be shipped to an assembly/packaging plant where it will undergo [[encapsulation]], producing the final chip that ships to customers. |
=== Known good die === | === Known good die === | ||
{{main|known good die|l1=Known Good Die (KGD)}} | {{main|known good die|l1=Known Good Die (KGD)}} | ||
− | A '''[[known good die]]''' | + | A '''[[known good die]]''' is a special type of bare die that underwent additional testing and screening post-[[singulation]]. KGD testing ensures the die meets the required specification prior to getting packaged. KGDs are especially important in [[multi-chip packages]] where multiple dies in a single package must function correctly to produce the required product. |
== Die size == | == Die size == | ||
− | |||
Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single [[wafer]], the die size is a strong indicator of cost. | Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single [[wafer]], the die size is a strong indicator of cost. | ||
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|- style="vertical-align: top;" | |- style="vertical-align: top;" | ||
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− | |||
* 815 mm² (GV100) | * 815 mm² (GV100) | ||
* 754 mm² (TU102) | * 754 mm² (TU102) | ||
− | |||
* 610 mm² (GP100) | * 610 mm² (GP100) | ||
* 601 mm² (GM200) | * 601 mm² (GM200) | ||
* 596 mm² (Fiji) | * 596 mm² (Fiji) | ||
* 576 mm² (GT200) | * 576 mm² (GT200) | ||
− | * | + | * 56 mm²1 (GK110) |
* 545 mm² (TU104) | * 545 mm² (TU104) | ||
* 510 mm² (Vega 10) | * 510 mm² (Vega 10) | ||
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* 246 mm² (BDW LCC) | * 246 mm² (BDW LCC) | ||
| | | | ||
− | * 2x 74 mm² + 1x 125 mm² ( | + | * 2x 74 mm² + 1x 125 mm² (Matisse) |
− | * 213 mm² ( | + | * 213 mm² (Pinnacle Ridge) |
− | * 213 mm² ( | + | * 213 mm² (Summit Ridge) |
− | * 210 mm² ( | + | * 210 mm² (Picasso) |
− | * 210 mm² ( | + | * 210 mm² (Raven Ridge) |
− | * 199 mm² ( | + | * 199 mm² (Comet Lake 10C) |
− | * 174 mm² ( | + | * 174 mm² (Coffee Lake 8C) |
− | * 156 mm² ( | + | * 156 mm² (Renoir) |
− | * 150 mm² ( | + | * 150 mm² (Coffee Lake 6C) |
− | * 123 mm² ( | + | * 123 mm² (Ice Lake 4C) |
− | * 122 mm² ( | + | * 122 mm² (Skylake 4C) |
− | * 102 mm² ( | + | * 102 mm² (Skylake 2C) |
| | | | ||
* 163 mm² (A5X) | * 163 mm² (A5X) |