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Editing die
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{{title|Die}} | {{title|Die}} | ||
− | [[File:ibm power9 die.jpg|right | + | [[File:ibm power9 die.jpg|right|thumb|IBM {{ibm|Power9|l=arch}} die.]] |
− | + | A '''die''' is the actual IC chip and is the final product of the [[fabrication process]]. It is the individual chip made following the [[singulation]] of a [[wafer]]. Dies typically undergo packaging before being sold to the customer as a final product. | |
− | A '''die''' is the actual | ||
== Overview == | == Overview == | ||
− | The | + | The die is the final product of the [[fabrication process]]. A fully processed wafer will under [[singulation]] following [[wafer probing|probing]]. Depending on the application, the die may be shipped to an assembly/packaging plant where it will undergo [[encapsulation]], producing the final chip that ships to customers. |
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== Die size == | == Die size == | ||
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Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single [[wafer]], the die size is a strong indicator of cost. | Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single [[wafer]], the die size is a strong indicator of cost. | ||
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* 815 mm² (GV100) | * 815 mm² (GV100) | ||
* 754 mm² (TU102) | * 754 mm² (TU102) | ||
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* 610 mm² (GP100) | * 610 mm² (GP100) | ||
* 601 mm² (GM200) | * 601 mm² (GM200) | ||
* 596 mm² (Fiji) | * 596 mm² (Fiji) | ||
* 576 mm² (GT200) | * 576 mm² (GT200) | ||
− | * | + | * 56 mm²1 (GK110) |
* 545 mm² (TU104) | * 545 mm² (TU104) | ||
* 510 mm² (Vega 10) | * 510 mm² (Vega 10) | ||
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* 445 mm² (TU106) | * 445 mm² (TU106) | ||
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− | * 8x 74 mm² + 1x 416 mm² ( | + | * 8x 74 mm² + 1x 416 mm² (Rome) |
− | * 4x 213 mm² ( | + | * 4x 213 mm² (Naples) |
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* 694 mm² (SKL LCC) | * 694 mm² (SKL LCC) | ||
− | * 693 mm² ( | + | * 693 mm² (Power9) |
* 662 mm² (HSW HCC) | * 662 mm² (HSW HCC) | ||
− | * 649 mm² ( | + | * 649 mm² (Power8) |
* 637 mm² (SPARC64 X) | * 637 mm² (SPARC64 X) | ||
* 600 mm² (SPARC64 X+) | * 600 mm² (SPARC64 X+) | ||
− | * 567 mm² ( | + | * 567 mm² (Power7) |
* 513 mm² (SPARC64 VIIIfx) | * 513 mm² (SPARC64 VIIIfx) | ||
* 492 mm² (HSW MCC) | * 492 mm² (HSW MCC) | ||
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* 444 mm² (SPARC64 VII) | * 444 mm² (SPARC64 VII) | ||
* 421 mm² (SPARC64 VI) | * 421 mm² (SPARC64 VI) | ||
− | * 412 mm² ( | + | * 412 mm² (Power4) |
* 389 mm² (Power5) | * 389 mm² (Power5) | ||
* 380 mm² (SPARC64 V) | * 380 mm² (SPARC64 V) | ||
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* 246 mm² (BDW LCC) | * 246 mm² (BDW LCC) | ||
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* 163 mm² (A5X) | * 163 mm² (A5X) |