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| {{title|Die}} | | {{title|Die}} |
− | [[File:ibm power9 die.jpg|right|250px|thumb|IBM {{ibm|Power9|l=arch}} die.]] | + | [[File:ibm power9 die.jpg|right|thumb|IBM {{ibm|Power9|l=arch}} die.]] |
− | [[File:6x6_waffle_pack.jpg|right|thumb|200px||A [[waffle pack]] with 36 dies.]]
| + | A '''die''' is the actual IC chip and is the final product of the [[fabrication process]]. It is the individual chip made following the [[singulation]] of a [[wafer]]. Dies typically undergo packaging before being sold to the customer as a final product. |
− | A '''die''' is the actual bare IC chip and is the final product of the [[fabrication process]]. It is the individual chip made following the [[singulation]] of a [[wafer]]. Dies typically undergo packaging before being sold to the customer as a final product. | |
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− | == Overview ==
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− | The '''die''' is the final product of the [[fabrication process]]. A fully processed wafer will undergo [[singulation]] following [[wafer probing|probing]]. Depending on the application, the die may be shipped to an assembly/packaging plant where it will undergo further [[encapsulation]], producing the final chip that ships to customers.
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− | === Known good die ===
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− | {{main|known good die|l1=Known Good Die (KGD)}}
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− | A '''[[known good die]]''' ('''KGD''') is a special type of bare die that underwent additional testing and screening post-[[singulation]]. KGD testing ensures the die meets the required specification prior to getting packaged. KGDs are especially important in [[multi-chip packages]] where multiple dies in a single package must function correctly to produce the required product.
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− | == Die size ==
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− | {{main|die size}}
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− | Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single [[wafer]], the die size is a strong indicator of cost.
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− | {| class="wikitable"
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− | ! colspan="4" | Select Large Dies
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− | |-
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− | ! GPU !! Server !! Desktop !! Mobile
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− | |- style="vertical-align: top;"
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− | |
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− | * 826 mm² (GA100)
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− | * 815 mm² (GV100)
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− | * 754 mm² (TU102)
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− | * 628 mm² (GA102)
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− | * 610 mm² (GP100)
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− | * 601 mm² (GM200)
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− | * 596 mm² (Fiji)
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− | * 576 mm² (GT200)
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− | * 561 mm² (GK110)
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− | * 545 mm² (TU104)
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− | * 510 mm² (Vega 10)
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− | * 484 mm² (G80)
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− | * 471 mm² (GP102)
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− | * 445 mm² (TU106)
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− | * 8x 74 mm² + 1x 416 mm² ({{amd|Rome|l=core}})
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− | * 4x 213 mm² ({{amd|Naples|l=core}})
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− | * 720 mm² ({{intel|Knights Corner|l=arch}})
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− | * 694 mm² (SKL LCC)
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− | * 693 mm² ({{ibm|Power9|l=arch}})
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− | * 662 mm² (HSW HCC)
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− | * 649 mm² ({{ibm|Power8|l=arch}})
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− | * 637 mm² (SPARC64 X)
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− | * 600 mm² (SPARC64 X+)
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− | * 567 mm² ({{ibm|Power7|l=arch}})
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− | * 513 mm² (SPARC64 VIIIfx)
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− | * 492 mm² (HSW MCC)
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− | * 485 mm² (SKL LCC)
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− | * 456 mm² (BDW HCC)
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− | * 444 mm² (SPARC64 VII)
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− | * 421 mm² (SPARC64 VI)
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− | * 412 mm² ({{ibm|Power4|l=arch}})
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− | * 389 mm² (Power5)
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− | * 380 mm² (SPARC64 V)
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− | * 362 mm² (Power8 6C)
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− | * 354 mm² (HSW LCC)
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− | * 341 mm² (Power6)
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− | * 325 mm² (SKL LCC)
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− | * 306 mm² (BDW MCC)
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− | * 270 mm² (Power3)
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− | * 246 mm² (BDW LCC)
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− | * 2x 74 mm² + 1x 125 mm² ({{amd|Matisse|l=core}})
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− | * 213 mm² ({{amd|Pinnacle Ridge|l=core}})
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− | * 213 mm² ({{amd|Summit Ridge|l=core}})
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− | * 210 mm² ({{amd|Picasso|l=core}})
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− | * 210 mm² ({{amd|Raven Ridge|l=core}})
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− | * 199 mm² ({{intel|Comet Lake S|Comet Lake 10C|l=core}})
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− | * 174 mm² ({{intel|Comet Lake S|Coffee Lake 8C|l=core}})
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− | * 156 mm² ({{amd|Renoir|l=core}})
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− | * 150 mm² ({{intel|Comet Lake S|Coffee Lake 6C|l=core}})
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− | * 123 mm² ({{intel|Ice Lake U|Ice Lake 4C|l=core}})
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− | * 122 mm² ({{intel|Skylake S|Skylake 4C|l=core}})
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− | * 102 mm² ({{intel|Skylake U|Skylake 2C|l=core}})
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− | * 163 mm² (A5X)
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− | * 147 mm² (A9X)
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− | * 128 mm² (A8X)
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− | * 125 mm² (A10)
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− | * 123 mm² (A6X)
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− | * 122 mm² (A12X)
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− | * 122 mm² (A12)
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− | * 122 mm² (A5)
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− | * 104 mm² (A9)
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− | * 102 mm² (A7)
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− | * 96 mm² (A10X)
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− | * 95 mm² (A6)
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− | * 89 mm² (A8)
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− | * 88 mm² (A11)
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− | * 53 mm² (A4)
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− | |}
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− | {{expand list}}
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− | == See also ==
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− | * [[yield]]
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