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{{title|Die}}
 
{{title|Die}}
[[File:ibm power9 die.jpg|right|250px|thumb|IBM {{ibm|Power9|l=arch}} die.]]
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A '''die''' is the actual IC chip and is the final product of the [[fabrication process]]. It is the individual chip made following the [[singulation]] of a [[wafer]]. Dies typically undergo packaging before being sold to the customer as a final product.
[[File:6x6_waffle_pack.jpg|right|thumb|200px||A [[waffle pack]] with 36 dies.]]
 
A '''die''' is the actual bare IC chip and is the final product of the [[fabrication process]]. It is the individual chip made following the [[singulation]] of a [[wafer]]. Dies typically undergo packaging before being sold to the customer as a final product.
 
 
 
== Overview ==
 
The '''die''' is the final product of the [[fabrication process]]. A fully processed wafer will undergo [[singulation]] following [[wafer probing|probing]]. Depending on the application, the die may be shipped to an assembly/packaging plant where it will undergo further [[encapsulation]], producing the final chip that ships to customers.
 
 
 
=== Known good die ===
 
{{main|known good die|l1=Known Good Die (KGD)}}
 
A '''[[known good die]]''' ('''KGD''') is a special type of bare die that underwent additional testing and screening post-[[singulation]]. KGD testing ensures the die meets the required specification prior to getting packaged. KGDs are especially important in [[multi-chip packages]] where multiple dies in a single package must function correctly to produce the required product.
 
 
 
== Die size ==
 
{{main|die size}}
 
Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single [[wafer]], the die size is a strong indicator of cost.
 
 
 
{| class="wikitable"
 
! colspan="4" | Select Large Dies
 
|-
 
! GPU !! Server !! Desktop !! Mobile
 
|- style="vertical-align: top;"
 
|
 
* 826 mm² (GA100)
 
* 815 mm² (GV100)
 
* 754 mm² (TU102)
 
* 628 mm² (GA102)
 
* 610 mm² (GP100)
 
* 601 mm² (GM200)
 
* 596 mm² (Fiji)
 
* 576 mm² (GT200)
 
* 561 mm² (GK110)
 
* 545 mm² (TU104)
 
* 510 mm² (Vega 10)
 
* 484 mm² (G80)
 
* 471 mm² (GP102)
 
* 445 mm² (TU106)
 
|
 
* 8x 74 mm² + 1x 416 mm² ({{amd|Rome|l=core}})
 
* 4x 213 mm² ({{amd|Naples|l=core}})
 
* 720 mm² ({{intel|Knights Corner|l=arch}})
 
* 694 mm² (SKL LCC)
 
* 693 mm² ({{ibm|Power9|l=arch}})
 
* 662 mm² (HSW HCC)
 
* 649 mm² ({{ibm|Power8|l=arch}})
 
* 637 mm² (SPARC64 X)
 
* 600 mm² (SPARC64 X+)
 
* 567 mm² ({{ibm|Power7|l=arch}})
 
* 513 mm² (SPARC64 VIIIfx)
 
* 492 mm² (HSW MCC)
 
* 485 mm² (SKL LCC)
 
* 456 mm² (BDW HCC)
 
* 444 mm² (SPARC64 VII)
 
* 421 mm² (SPARC64 VI)
 
* 412 mm² ({{ibm|Power4|l=arch}})
 
* 389 mm² (Power5)
 
* 380 mm² (SPARC64 V)
 
* 362 mm² (Power8 6C)
 
* 354 mm² (HSW LCC)
 
* 341 mm² (Power6)
 
* 325 mm² (SKL LCC)
 
* 306 mm² (BDW MCC)
 
* 270 mm² (Power3)
 
* 246 mm² (BDW LCC)
 
|
 
* 2x 74 mm² + 1x 125 mm² ({{amd|Matisse|l=core}})
 
* 213 mm² ({{amd|Pinnacle Ridge|l=core}})
 
* 213 mm² ({{amd|Summit Ridge|l=core}})
 
* 210 mm² ({{amd|Picasso|l=core}})
 
* 210 mm² ({{amd|Raven Ridge|l=core}})
 
* 199 mm² ({{intel|Comet Lake S|Comet Lake 10C|l=core}})
 
* 174 mm² ({{intel|Comet Lake S|Coffee Lake 8C|l=core}})
 
* 156 mm² ({{amd|Renoir|l=core}})
 
* 150 mm² ({{intel|Comet Lake S|Coffee Lake 6C|l=core}})
 
* 123 mm² ({{intel|Ice Lake U|Ice Lake 4C|l=core}})
 
* 122 mm² ({{intel|Skylake S|Skylake 4C|l=core}})
 
* 102 mm² ({{intel|Skylake U|Skylake 2C|l=core}})
 
|
 
* 163 mm² (A5X)
 
* 147 mm² (A9X)
 
* 128 mm² (A8X)
 
* 125 mm² (A10)
 
* 123 mm² (A6X)
 
* 122 mm² (A12X)
 
* 122 mm² (A12)
 
* 122 mm² (A5)
 
* 104 mm² (A9)
 
* 102 mm² (A7)
 
* 96 mm² (A10X)
 
* 95 mm² (A6)
 
* 89 mm² (A8)
 
* 88 mm² (A11)
 
* 53 mm² (A4)
 
|}
 
{{expand list}}
 
 
 
== See also ==
 
* [[yield]]
 

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