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== Die ==
 
== Die ==
=== 0.35 μm ===
+
=== ARM9TDMI ===
==== ARM9TDMI ====
 
 
* [[0.35 μm process]]
 
* [[0.35 μm process]]
 
* 112,000 transistors
 
* 112,000 transistors
 
* 4.15 mm² die size
 
* 4.15 mm² die size
 
* 1.8 mW/MHz @ 3.0V
 
* 1.8 mW/MHz @ 3.0V
* 120 MHz max frequency
 
  
==== ARM940T ====
+
=== ARM940T ===
 
* [[0.35 μm process]]
 
* [[0.35 μm process]]
 
* 800,000 transistors
 
* 800,000 transistors
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* 2 x 4 KiB caches
 
* 2 x 4 KiB caches
 
* 400 mW @  120 MHz core / 16 MHz bus
 
* 400 mW @  120 MHz core / 16 MHz bus
 
=== 0.25 μm ===
 
==== ARM9TDMI ====
 
* [[0.25 μm process]]
 
* 3 metal layers
 
* 110,000 transistors
 
* 4.15 mm² die size
 
* 2.5 V
 
* 200 MHz max frequency
 
* 150 mW
 
 
=== 0.18 μm ===
 
==== ARM926EJ-S ====
 
* [[0.18 μm process]]
 
* 8.3 mm² die size (with cache)
 
* 4.0 mm² die size (without cache)
 
* 180-200 MHz max frequency
 
* 1.40 mW/MHz with cache
 
* 1.00 mW/MHz without cache
 
 
=== 0.13 μm ===
 
==== ARM926EJ-S ====
 
* [[0.13 μm process]]
 
* 3.2 mm² die size (with cache)
 
* 1.68 mm² die size (without cache)
 
* 266 MHz max frequency
 
* 0.45 mW/MHz with cache
 
* 0.30 mW/MHz without cache
 
  
 
== Bibliography ==
 
== Bibliography ==
 
* October 16, 1997. Press Release {{\|pr1|"ARM announces new higher performance, low power ARM9 processor architecture"}}.
 
* October 16, 1997. Press Release {{\|pr1|"ARM announces new higher performance, low power ARM9 processor architecture"}}.
 
* Segars, Simon. "The ARM9 Family-High Performance Microprocessors for Embedded Applications." Proceedings of the International Conference on Computer Design. 1998.
 
* Segars, Simon. "The ARM9 Family-High Performance Microprocessors for Embedded Applications." Proceedings of the International Conference on Computer Design. 1998.

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codenameARM9 +
designerARM Holdings +
first launchedOctober 16, 1997 +
full page namearm holdings/microarchitectures/arm9 +
instance ofmicroarchitecture +
manufacturerTSMC + and VLSI Technology +
microarchitecture typeCPU +
nameARM9 +