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− | < | + | <div class="guidebox"> |
− | < | + | <div style="text-align: center;">[[3D Integration|<span style="color: rgba(0,0,0,.53); text-shadow: 0px 2px 3px rgba(0,0,0,.33); font-size: 20pt; font-weight: bold; ">3D Integration</span>]]<br>[[File:wc 3d stack.svg|225px|link=3d integration]]</div> |
− | + | <div class="header">Technologies</div> | |
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* [[Wire bonding]] | * [[Wire bonding]] | ||
* [[thruchip interface|TCI]] | * [[thruchip interface|TCI]] | ||
* [[through-silicon via|TSV]] | * [[through-silicon via|TSV]] | ||
− | + | <div class="header">Concepts</div> | |
− | + | * [[3d die stacking|3D Die Stacking]] | |
− | + | * [[3d substrate stacking|3D Substrate Stacking]] | |
− | + | * [[2.5d die stacking|2.5D Die Stacking]] | |
− | + | <div></div>{{Navbar|Template:3d integration|text=|mini=1|style=float:right;}} | |
− | + | </div> | |
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