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{{Lithography processes}} | {{Lithography processes}} | ||
− | The ''' | + | The '''45 nm lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[55 nm lithography process|55 nm process]] stopgap. Commercial [[integrated circuit]] manufacturing using 45 nm process began in 2007. This technology was superseded by the [[40 nm lithography process|40 nm process]] (HN) / [[32 nm lithography process|32 nm process]] (FN) in 2010. |
== Industry == | == Industry == | ||
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{{scrolling table/top|style=text-align: right; | first=Fab | {{scrolling table/top|style=text-align: right; | first=Fab | ||
|Process Name | |Process Name | ||
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{{scrolling table/mid}} | {{scrolling table/mid}} | ||
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− | ! colspan="2" | [[Intel]] !! colspan="2" | [[Fujitsu]] !! colspan="2" | [[TI]] !! colspan="2" | [[Toshiba]] / [[Sony]] / [[NEC | + | ! colspan="2" | [[Intel]] !! colspan="2" | [[Fujitsu]] !! colspan="2" | [[TI]] !! colspan="2" | [[Toshiba]] / [[Sony]] / [[NEC]] !! colspan="2" | [[IBM]] / [[Toshiba]] / [[Sony]] / [[AMD]] |
|- style="text-align: center;" | |- style="text-align: center;" | ||
− | | colspan="2" | P1266 | + | | colspan="2" | P1266 || colspan="2" | CS-300 || colspan="2" | || colspan="2" | || colspan="2" | |
|- style="text-align: center;" | |- style="text-align: center;" | ||
− | | colspan="2" | | + | | colspan="2" | 2007 || colspan="2" | 2008 || colspan="2" | 2008 || colspan="2" | 2006 || colspan="2" | 2007 |
|- style="text-align: center;" | |- style="text-align: center;" | ||
− | | colspan=" | + | | colspan="8" | Bulk || colspan="2" | PDSOI |
|- style="text-align: center;" | |- style="text-align: center;" | ||
− | | colspan=" | + | | colspan="10" | 300mm |
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− | + | ! Value !! [[65 nm]] Δ !! Value !! [[65 nm]] Δ !! Value !! [[65 nm]] Δ !! Value !! [[65 nm]] Δ !! Value !! [[65 nm]] Δ | |
|- | |- | ||
− | | 180 nm || 0.82x || 190 nm || ?x || ? nm || ?x || 180 | + | | 180 nm || 0.82x || 190 nm || ?x || ? nm || ?x || 180 nm || ?x || 190 nm || 0.76x |
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− | | 160 nm || 0.76x || ? nm || ?x || ? nm || ?x || ? nm || ?x || | + | | 160 nm || 0.76x || ? nm || ?x || ? nm || ?x || ? nm || ?x || ? nm || ?x |
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− | | 0.346 | + | | 0.346 µm<sup>2</sup> || 0.61x || 0.225 µm<sup>2</sup> || ?x || 0.255 µm<sup>2</sup> || ?x || 0.248 µm<sup>2</sup> || ?x || 0.370 µm<sup>2</sup> || 0.57x |
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− | | | + | | || || || || || || || || || |
|- | |- | ||
− | | || || || || || || || | + | | || || || || || || || || 0.067 µm<sup>2</sup> || 0.53x |
{{scrolling table/end}} | {{scrolling table/end}} | ||
− | === | + | === Design Rules === |
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{| class="wikitable collapsible collapsed" | {| class="wikitable collapsible collapsed" | ||
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− | ! colspan="4" | | + | ! colspan="4" | Design Rules |
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! Layer !! Pitch !! Thick !! Aspect Ratio | ! Layer !! Pitch !! Thick !! Aspect Ratio | ||
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** {{amd|Opteron}} | ** {{amd|Opteron}} | ||
** {{amd|Phenom II}} | ** {{amd|Phenom II}} | ||
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* IBM | * IBM | ||
** {{ibm|Power7}} | ** {{ibm|Power7}} | ||
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** {{intel|Xeon}} | ** {{intel|Xeon}} | ||
− | {{expand list}} | + | {{expand list}} |
+ | |||
+ | == 45 nm System on Chips== | ||
{{expand list}} | {{expand list}} | ||
== 45 nm Microarchitectures == | == 45 nm Microarchitectures == | ||
− | + | * Intel: | |
− | + | ** {{intel|Bonnell}} | |
− | + | ** {{intel|Nehalem}} | |
− | + | ** {{intel|Penryn}} | |
− | * Intel | ||
− | ** {{intel|Bonnell | ||
− | ** {{intel|Nehalem | ||
− | ** {{intel|Penryn | ||
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{{expand list}} | {{expand list}} | ||
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