Semiconductor & Computer Engineering
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Difference between revisions of "2 µm lithography process"
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Revision as of 05:38, 4 April 2017
Semiconductor lithography processes technology
The 2 µm lithography process was the semiconductor process technology used by the some semiconductor companies in the mid to late 1980s. By the mid 80s this process was replaced by 1.5 µm, 1.3 µm, and 1.2 µm processes.
Industry
| Fab |
|---|
| Process Name |
| 1st Production |
| Contacted Gate Pitch |
| Interconnect Pitch (M1P) |
| SRAM bit cell |
| Intel | Intel | Toshiba | STMicro | Motorola | TI | AMD |
|---|---|---|---|---|---|---|
| P414.1 (HMOS-II) | P421.X (HMOS-E) | BCD-Offline | ||||
| 1980 | 1980 | 1986 | 1992 | |||
| ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm |
| ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm |
| ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 |
Microprocessors
This list is incomplete; you can help by expanding it.
References
- Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.
