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|name=ARM9
 
|name=ARM9
 
|designer=ARM Holdings
 
|designer=ARM Holdings
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|manufacturer=TSMC
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|manufacturer=VLSI Technology
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|manufacturer 2=TSMC
 
|introduction=October 16, 1997
 
|introduction=October 16, 1997
 
|predecessor=ARM8
 
|predecessor=ARM8
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}}
 
}}
 
'''ARM9''' is the successor to the {{armh|ARM8|l=arch}}, a low-power performance [[ARM]] [[microarchitecture]] designed by [[ARM Holdings]] for the mobile market. This microarchitecture is designed as an [[IP core]] and is sold to other semiconductor companies to be implemented in their own chips.
 
'''ARM9''' is the successor to the {{armh|ARM8|l=arch}}, a low-power performance [[ARM]] [[microarchitecture]] designed by [[ARM Holdings]] for the mobile market. This microarchitecture is designed as an [[IP core]] and is sold to other semiconductor companies to be implemented in their own chips.
 +
 +
== Architecture ==
 +
=== Key changes from {{\\|ARM8}}===
 +
{{empty section}}
 +
=== Block Diagram ===
 +
{{empty section}}
 +
=== Memory Hierarchy ===
 +
{{empty section}}
 +
 +
== Licensees ==
 +
In 2013 Arm reported 271 licensees. The following were named.
 +
 +
<div class="wiki-ul-col3">
 +
* [[Accent]]
 +
* [[Alcatel]]
 +
* [[Alchip]]
 +
* [[All Winner Technology (Holding) Ltd]]
 +
* [[Altera]]
 +
* [[Analog Devices Inc.]]
 +
* [[ARCA]]
 +
* [[Atheros Communications]]
 +
* [[Atmel Corporation]]
 +
* [[Austriamicrosystems]]
 +
* [[Avago Technologies]]
 +
* [[Avalink Incorporated]]
 +
* [[Beken Corporation]]
 +
* [[Broadcom Corporation]]
 +
* [[Cambridge Silicon Radio]]
 +
* [[Capital Semiconductor Ltd]]
 +
* [[Chongqing Chongyou IT]]
 +
* [[Cirrus Logic]]
 +
* [[Conexant Systems Inc.]]
 +
* [[Datang Microelectronics Technology]]
 +
* [[eSilicon Corporation]]
 +
* [[Faraday TechFocus Enhancements]]
 +
* [[Freescale Semiconductor]]
 +
* [[Fujitsu]]
 +
* [[GCT Semiconductor]]
 +
* [[Global Unichip Corporation]]
 +
* [[Huawei Technologies]]
 +
* [[ICP]]
 +
* [[Infineon Technologies AG]]
 +
* [[Ironkey Incorporated]]
 +
* [[Kawasaki Microelectronics]]
 +
* [[Key ASIC]]
 +
* [[Leadcore Technology Co Ltd]]
 +
* [[LSI Logic]]
 +
* [[Marvell Semiconductor]]
 +
* [[Mediatek Inc]]
 +
* [[Micrel]]
 +
* [[Mindspeed Technologies Inc.]]
 +
* [[Moschip Semiconductor]]
 +
* [[Mtekvision]]
 +
* [[NationZ Technologies Inc]]
 +
* [[NEC Electronics]]
 +
* [[Neo Magic Corporation]]
 +
* [[NXP]]
 +
* [[Nuvoton Technology Corporation]]
 +
* [[NVidia Corporation]]
 +
* [[OKI]]
 +
* [[Panasonic]]
 +
* [[Parrot]]
 +
* [[Pixim]]
 +
* [[PulseLink]]
 +
* [[Qualcomm]]
 +
* [[Quanta Computer Inc]]
 +
* [[Renesas Technology]]
 +
* [[RF Micro Devices]]
 +
* [[Rohm]]
 +
* [[Samsung Electronics]]
 +
* [[Sandisk]]
 +
* [[Sanyo Electric Co Ltd]]
 +
* [[Shanghai Jade Technologies]]
 +
* [[Sharp Corporation]]
 +
* [[Sierra Wireless SA]]
 +
* [[Skyworks Solutions Inc.]]
 +
* [[Socle Technology Corp]]
 +
* [[Sony]]
 +
* [[STMicroelectronics]]
 +
* [[Standard Microsystems]]
 +
* [[Telechips]]
 +
* [[Texas Instruments]]
 +
* [[Toshiba]]
 +
* [[TSMC]]
 +
* [[Verisilicon]]
 +
* [[Wisair]]
 +
* [[Zoran Corporation]]
 +
</div>
 +
 +
== Die ==
 +
=== 0.35 μm ===
 +
==== ARM9TDMI ====
 +
* [[0.35 μm process]]
 +
* 112,000 transistors
 +
* 4.15 mm² die size
 +
* 1.8 mW/MHz @ 3.0V
 +
* 120 MHz max frequency
 +
 +
==== ARM940T ====
 +
* [[0.35 μm process]]
 +
* 800,000 transistors
 +
* 13.0 mm² die size
 +
* 2 x 4 KiB caches
 +
* 400 mW @  120 MHz core / 16 MHz bus
 +
 +
=== 0.25 μm ===
 +
==== ARM9TDMI ====
 +
* [[0.25 μm process]]
 +
* 3 metal layers
 +
* 110,000 transistors
 +
* 4.15 mm² die size
 +
* 2.5 V
 +
* 200 MHz max frequency
 +
* 150 mW
 +
 +
=== 0.18 μm ===
 +
==== ARM926EJ-S ====
 +
* [[0.18 μm process]]
 +
* 8.3 mm² die size (with cache)
 +
* 4.0 mm² die size (without cache)
 +
* 180-200 MHz max frequency
 +
* 1.40 mW/MHz with cache
 +
* 1.00 mW/MHz without cache
 +
 +
=== 0.13 μm ===
 +
==== ARM926EJ-S ====
 +
* [[0.13 μm process]]
 +
* 3.2 mm² die size (with cache)
 +
* 1.68 mm² die size (without cache)
 +
* 266 MHz max frequency
 +
* 0.45 mW/MHz with cache
 +
* 0.30 mW/MHz without cache
  
 
== Bibliography ==
 
== Bibliography ==
 
* October 16, 1997. Press Release {{\|pr1|"ARM announces new higher performance, low power ARM9 processor architecture"}}.
 
* October 16, 1997. Press Release {{\|pr1|"ARM announces new higher performance, low power ARM9 processor architecture"}}.
 +
* Segars, Simon. "The ARM9 Family-High Performance Microprocessors for Embedded Applications." Proceedings of the International Conference on Computer Design. 1998.

Latest revision as of 03:45, 9 October 2020

Edit Values
ARM9 µarch
General Info
Arch TypeCPU
DesignerARM Holdings
ManufacturerVLSI Technology, TSMC
IntroductionOctober 16, 1997
Succession

ARM9 is the successor to the ARM8, a low-power performance ARM microarchitecture designed by ARM Holdings for the mobile market. This microarchitecture is designed as an IP core and is sold to other semiconductor companies to be implemented in their own chips.

Architecture[edit]

Key changes from ARM8[edit]

New text document.svg This section is empty; you can help add the missing info by editing this page.

Block Diagram[edit]

New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory Hierarchy[edit]

New text document.svg This section is empty; you can help add the missing info by editing this page.

Licensees[edit]

In 2013 Arm reported 271 licensees. The following were named.

Die[edit]

0.35 μm[edit]

ARM9TDMI[edit]

  • 0.35 μm process
  • 112,000 transistors
  • 4.15 mm² die size
  • 1.8 mW/MHz @ 3.0V
  • 120 MHz max frequency

ARM940T[edit]

  • 0.35 μm process
  • 800,000 transistors
  • 13.0 mm² die size
  • 2 x 4 KiB caches
  • 400 mW @ 120 MHz core / 16 MHz bus

0.25 μm[edit]

ARM9TDMI[edit]

  • 0.25 μm process
  • 3 metal layers
  • 110,000 transistors
  • 4.15 mm² die size
  • 2.5 V
  • 200 MHz max frequency
  • 150 mW

0.18 μm[edit]

ARM926EJ-S[edit]

  • 0.18 μm process
  • 8.3 mm² die size (with cache)
  • 4.0 mm² die size (without cache)
  • 180-200 MHz max frequency
  • 1.40 mW/MHz with cache
  • 1.00 mW/MHz without cache

0.13 μm[edit]

ARM926EJ-S[edit]

  • 0.13 μm process
  • 3.2 mm² die size (with cache)
  • 1.68 mm² die size (without cache)
  • 266 MHz max frequency
  • 0.45 mW/MHz with cache
  • 0.30 mW/MHz without cache

Bibliography[edit]

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Facts about "ARM9 - Microarchitectures - ARM"
RDF feed
codenameARM9 +
designerARM Holdings +
first launchedOctober 16, 1997 +
full page namearm holdings/microarchitectures/arm9 +
instance ofmicroarchitecture +
manufacturerVLSI Technology + and TSMC +
microarchitecture typeCPU +
nameARM9 +