Difference between revisions of "intel/core i3/i3-7167u"

	Edit Values
	Core i3-7167U
	General Info
Designer	Intel
Manufacturer	Intel
Model Number	i3-7167U
S-Spec	SR361
Market	Mobile
Introduction	January 3, 2017 (announced); January 3, 2017 (launched)
Release Price	$304.00
Shop	Amazon
	General Specs
Family	Core i3
Series	i3-7100
Locked	Yes
Frequency	2,800 MHz
Bus type	OPI
Bus rate	4 GT/s
Clock multiplier	28
	Microarchitecture
ISA	x86-64 (x86)
Microarchitecture	Kaby Lake
Platform	Kaby Lake
Core Name	Kaby Lake U
Core Family	6
Core Model	142
Core Stepping	J1
Process	14 nm
Technology	CMOS
Word Size	64 bit
Cores	2
Threads	4
Max Memory	32 GiB
	Multiprocessing
Max SMP	1-Way (Uniprocessor)
	Electrical
Vcore	0.55 V-1.52 V
TDP	28 W
cTDP down	23 W
Tjunction	0 °C – 100 °C
Tstorage	-25 °C – 125 °C
	Packaging
Package	FCBGA-1356 (BGA)
Dimension	42 mm x 24 mm x 1.3 mm
Pitch	0.65 mm
Ball Count	1356
Ball Comp	SAC405
Interconnect	BGA-1356

Latest revision as of 16:18, 13 December 2017

Core i3-7167U is a 64-bit dual-core low-end performance x86 mobile microprocessor introduced by Intel in early 2017. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's improved 14 nm+ process. This processor, which has a base frequency of 2.8 GHz with a TDP of 28 Watts, supports up to 32 GiB of dual-channel DDR4-2133. The i3-7167U incorporates Intel's Iris Plus Graphics 650 IGP operating at 300 MHz with burst frequency of 1 GHz. This GPU also includes 64 MiB of embedded DRAM.

This model has a configurable TDP-down of 23 W.

Cache[edit]

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

Cache Organization

Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.

L1$

128 KiB

131,072 B
0.125 MiB

L1I$	64 KiB 65,536 B 0.0625 MiB	2x32 KiB	8-way set associative
L1D$	64 KiB 65,536 B 0.0625 MiB	2x32 KiB	8-way set associative	write-back

L2$

512 KiB

0.5 MiB
524,288 B
4.882812e-4 GiB

		2x256 KiB	4-way set associative	write-back

L3$

3 MiB

3,072 KiB
3,145,728 B
0.00293 GiB

		2x1.5 MiB	16-way set associative	write-back

L4$

64 MiB

65,536 KiB
67,108,864 B
0.0625 GiB

Memory controller[edit]

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	LPDDR3-1866, DDR3L-1600, DDR4-2133
Supports ECC	No
Max Mem	64 GiB
Controllers	1
Channels	2
Max Bandwidth	31.79 GiB/s 32,552.96 MiB/s 34.134 GB/s 34,134.253 MB/s 0.031 TiB/s 0.0341 TB/s
Bandwidth	Single 15.89 GiB/s Double 31.79 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

Expansion Options

PCIe

Revision	3.0
Max Lanes	12
Configs	1x4, 2x2, 1x2+2x1, 4x1

Graphics[edit]

The Iris Plus Graphics 650 includes 64 MiB of L4 eDRAM cache in addition to everything else.

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU

Iris Plus Graphics 650

Designer

Intel

Device ID

0x5927

Execution Units

48

Max Displays

3

Max Memory

32 GiB

32,768 MiB
33,554,432 KiB
34,359,738,368 B

Frequency

300 MHz

0.3 GHz
300,000 KHz

Burst Frequency

1,000 MHz

1 GHz
1,000,000 KHz

Output

DP, eDP, HDMI, DVI

Max Resolution

HDMI	4096x2304 @30 Hz
DP	4096x2304 @60 Hz
eDP	4096x2304 @60 Hz

Standards

DirectX	12
OpenGL	4.4
OpenCL	2.0
DP	1.2
eDP	1.4
HDMI	1.4a

Additional Features

Intel Quick Sync Video

Intel InTru 3D

Intel Clear Video

Intel Clear Video HD

[Edit] Kaby Lake (Gen9.5) Hardware Accelerated Video Capabilities
Codec	Encode			Decode
Codec	Profiles	Levels	Max Resolution	Profiles	Levels	Max Resolution
MPEG-2 (H.262)	Main	High	1080p (FHD)	Main	Main, High	1080p (FHD)
MPEG-4 AVC (H.264)	High, Main	5.1	2160p (4K)	Main, High, MVC, Stereo	5.1	2160p (4K)
JPEG/MJPEG	Baseline	-	16k x 16k	Baseline	Unified	16k x 16k
HEVC (H.265)	Main, Main 10	5.1	2160p (4K)	Main, Main 10	5.1	2160p (4K)
VC-1	✘			Advanced, Main, Simple	3, High, Simple	3840x3840
VP8	Unified	Unified	N/A	0	Unified	1080p
VP9	0		2160p (4K)	0, 2	Unified	2160p (4K)

Features[edit]

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX	MMX Extension
EMMX	Extended MMX Extension
SSE	Streaming SIMD Extensions
SSE2	Streaming SIMD Extensions 2
SSE3	Streaming SIMD Extensions 3
SSSE3	Supplemental SSE3
SSE4.1	Streaming SIMD Extensions 4.1
SSE4.2	Streaming SIMD Extensions 4.2
AVX	Advanced Vector Extensions
AVX2	Advanced Vector Extensions 2
ABM	Advanced Bit Manipulation
BMI1	Bit Manipulation Instruction Set 1
BMI2	Bit Manipulation Instruction Set 2
FMA3	3-Operand Fused-Multiply-Add
AES	AES Encryption Instructions
RdRand	Hardware RNG
ADX	Multi-Precision Add-Carry
CLMUL	Carry-less Multiplication Extension
F16C	16-bit Floating Point Conversion

x86-16	16-bit x86
x86-32	32-bit x86
x86-64	64-bit x86
Real	Real Mode
Protected	Protected Mode
SMM	System Management Mode
FPU	Integrated x87 FPU
NX	No-eXecute
HT	Hyper-Threading
EIST	Enhanced SpeedStep Technology
SST	Speed Shift Technology
VT-x	VT-x (Virtualization)
VT-d	VT-d (I/O MMU virtualization)
EPT	Extended Page Tables (SLAT)
MPX	Memory Protection Extensions
SGX	Software Guard Extensions
Secure Key	Secure Key Technology
SMEP	OS Guard Technology
Flex Memory	Flex Memory Access
ISRT	Smart Response Technology
SBA	Small Business Advantage
MWT	My WiFi Technology
IPT	Identity Protection Technology

@@ Line 1: / Line 1: @@
 {{intel title|Core i3-7167U}}
-{{mpu
+{{chip
-| name                = Core i3-7167U
+|name=Core i3-7167U
-| no image            = Yes
+|no image=Yes
-| image               =
+|designer=Intel
-| image size          =
+|manufacturer=Intel
-| caption             =
+|model number=i3-7167U
-| designer            = Intel
+|s-spec=SR361
-| manufacturer        = Intel
+|market=Mobile
-| model number        = i3-7167U
+|first announced=January 3, 2017
-| part number         =
+|first launched=January 3, 2017
-| part number 1       =
+|release price=$304.00
-| part number 2       =
+|family=Core i3
-| s-spec              =
+|series=i3-7100
-| s-spec 2            =
+|locked=Yes
-| market              = Mobile
+|frequency=2,800 MHz
-| first announced     = January 3, 2017
+|bus type=OPI
-| first launched      = January 3, 2017
+|bus rate=4 GT/s
-| last order          =
+|clock multiplier=28
-| last shipment       =
+|isa=x86-64
-| release price       =
+|isa family=x86
+|microarch=Kaby Lake
-| family              = Core i3
+|platform=Kaby Lake
-| series              = i3-7100
+|core name=Kaby Lake U
-| locked              = Yes
+|core family=6
-| frequency           = 2,800 MHz
+|core model=142
-| bus type            = DMI 3.0
+|core stepping=J1
-| bus speed           =
+|process=14 nm
-| bus rate            = 8 GT/s
+|technology=CMOS
-| clock multiplier    = 28
+|word size=64 bit
-| cpuid               =
+|core count=2
+|thread count=4
-| isa family          = x86
+|max cpus=1
-| isa                 = x86-64
+|max memory=32 GiB
-| microarch           = Kaby Lake
+|v core min=0.55 V
-| platform            = Kaby Lake
+|v core max=1.52 V
-| chipset             =
+|tdp=28 W
-| core name           = Kaby Lake U
+|ctdp down=23 W
-| core family         = 6
+|tjunc min=0 °C
-| core model          = 142
+|tjunc max=100 °C
-| core stepping       =
+|tstorage min=-25 °C
-| core stepping 2     =
+|tstorage max=125 °C
-| process             = 14 nm
+|package module 1={{packages/intel/fcbga-1356}}
-| transistors         =
-| technology          = CMOS
-| die area            =
-| die width           =
-| die length          =
-| word size           = 64 bit
-| core count          = 2
-| thread count        = 4
-| max cpus            = 1
-| max memory          = 32 GiB
-| electrical          = Yes
-| v core min          = 0.55 V
-| v core max          = 1.52 V
-| sdp                 =
-| tdp                 = 28 W
-| tdp typical         =
-| ctdp down           = 23 W
-| ctdp down frequency =
-| tjunc min           = 0 °C
-| tjunc max           = 100 °C
-| tcase min           =
-| tcase max           =
-| tstorage min        = -25 °C
-| tstorage max        = 125 °C
-| tambient min        =
-| tambient max        =
-| packaging          = Yes
-| package            = FCBGA-1356
-| package type       = FCBGA
-| package pitch      = 0.65 mm
-| package size       = 42 mm x 24 mm
-| socket             = BGA-1356
-| socket type        = BGA
 }}
 '''Core i3-7167U''' is a {{arch|64}} [[dual-core]] low-end performance [[x86]] mobile microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's improved [[14 nm|14 nm+ process]]. This processor, which has a base frequency of 2.8 GHz with a TDP of 28 Watts, supports up to 32 GiB of dual-channel DDR4-2133. The i3-7167U incorporates Intel's {{intel|Iris Plus Graphics 650}} [[IGP]] operating at 300 MHz with burst frequency of 1 GHz. This GPU also includes 64 MiB of [[eDRAM|embedded DRAM]].
-This specific model has a configurable TDP-down of 23 W.
+This model has a configurable TDP-down of 23 W.
 == Cache ==
 {{main|intel/microarchitectures/kaby_lake#Memory_Hierarchy|l1=Kaby Lake § Cache}}
@@ Line 89: / Line 53: @@
 |l1i break=2x32 KiB
 |l1i desc=8-way set associative
-|l1i policy=write-back
 |l1d cache=64 KiB
 |l1d break=2x32 KiB
@@ Line 174: / Line 137: @@
 | intel clear video hd = Yes
 }}
+{{kaby lake hardware accelerated video table|col=1}}
 == Features ==
@@ Line 185: / Line 149: @@
 |x8664=Yes
 |nx=Yes
-|3dnow=No
-|e3dnow=No
 |mmx=Yes
 |emmx=Yes
@@ Line 198: / Line 160: @@
 |avx=Yes
 |avx2=Yes
-|avx512=No
 |abm=Yes
 |tbm=No
@@ Line 218: / Line 180: @@
 |eist=Yes
 |sst=Yes
-|flex=No
+|flex=Yes
 |fastmem=No
 |isrt=Yes
@@ Line 237: / Line 199: @@
 |securekey=Yes
 |osguard=Yes
+|3dnow=No
+|e3dnow=No
 |smartmp=No
 |powernow=No
+|amdvi=No
 |amdv=No
 |rvi=No
+|smt=No
+|sensemi=No
+|xfr=No
 }}

Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Core i3-7167U - Intel#package + and Core i3-7167U - Intel#io +
base frequency	2,800 MHz (2.8 GHz, 2,800,000 kHz) +
bus rate	4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus type	OPI +
clock multiplier	28 +
core count	2 +
core family	6 +
core model	142 +
core name	Kaby Lake U +
core stepping	J1 +
core voltage (max)	1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)	0.55 V (5.5 dV, 55 cV, 550 mV) +
designer	Intel +
device id	0x5927 +
family	Core i3 +
first announced	January 3, 2017 +
first launched	January 3, 2017 +
full page name	intel/core i3/i3-7167u +
has advanced vector extensions	true +
has advanced vector extensions 2	true +
has ecc memory support	false +
has extended page tables support	true +
has feature	Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access +, Smart Response Technology +, Small Business Advantage +, My WiFi Technology + and Identity Protection Technology +
has intel enhanced speedstep technology	true +
has intel flex memory access support	true +
has intel identity protection technology support	true +
has intel my wifi technology support	true +
has intel secure key technology	true +
has intel small business advantage support	true +
has intel smart response technology support	true +
has intel speed shift technology	true +
has intel supervisor mode execution protection	true +
has intel vt-d technology	true +
has intel vt-x technology	true +
has locked clock multiplier	true +
has second level address translation support	true +
has simultaneous multithreading	true +
has x86 advanced encryption standard instruction set extension	true +
instance of	microprocessor +
integrated gpu	Iris Plus Graphics 650 +
integrated gpu base frequency	300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designer	Intel +
integrated gpu execution units	48 +
integrated gpu max frequency	1,000 MHz (1 GHz, 1,000,000 KHz) +
integrated gpu max memory	32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB) +
isa	x86-64 +
isa family	x86 +
l1$ size	128 KiB (131,072 B, 0.125 MiB) +
l1d$ description	8-way set associative +
l1d$ size	64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description	8-way set associative +
l1i$ size	64 KiB (65,536 B, 0.0625 MiB) +
l2$ description	4-way set associative +
l2$ size	0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description	16-way set associative +
l3$ size	3 MiB (3,072 KiB, 3,145,728 B, 0.00293 GiB) +
l4$ size	64 MiB (65,536 KiB, 67,108,864 B, 0.0625 GiB) +
ldate	January 3, 2017 +
manufacturer	Intel +
market segment	Mobile +
max cpu count	1 +
max junction temperature	373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory	32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) +
max memory bandwidth	31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels	2 +
max pcie lanes	12 +
max storage temperature	398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitecture	Kaby Lake +
min junction temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature	248.15 K (-25 °C, -13 °F, 446.67 °R) +
model number	i3-7167U +
name	Core i3-7167U +
package	FCBGA-1356 +
platform	Kaby Lake +
process	14 nm (0.014 μm, 1.4e-5 mm) +
release price	$ 304.00 (€ 273.60, £ 246.24, ¥ 31,412.32) +
s-spec	SR361 +
series	i3-7100 +
smp max ways	1 +
supported memory type	LPDDR3-1866 +, DDR3L-1600 + and DDR4-2133 +
tdp	28 W (28,000 mW, 0.0375 hp, 0.028 kW) +
tdp down	23 W (23,000 mW, 0.0308 hp, 0.023 kW) +
technology	CMOS +
thread count	4 +
word size	64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensions	true +
x86/has software guard extensions	true +

WikiChip

The Fuse Coverage

Social Media

Companies

Microarchitectures

Technology Nodes

Intel

AMD

ARM

Cavium

Samsung

Intel

AMD

Ampere

Apple

Cavium

HiSilicon

MediaTek

NXP

Qualcomm

Renesas

Samsung

Latest revision as of 16:18, 13 December 2017

Contents

Cache[edit]

Memory controller[edit]

Expansions[edit]

Graphics[edit]

Features[edit]