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(Created page with "{{amd title|AMD-K6-2/300BNZ-66}} '''K6-2/300BNZ-66''' was a {{arch|32}} x86 {{amd|microarchitectures/k6-2|K6-2}}-based mobile microprocessor designed and manufactured in [...")
 
m (Bot: moving all {{mpu}} to {{chip}})
 
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{{amd title|AMD-K6-2/300BNZ-66}}
 
{{amd title|AMD-K6-2/300BNZ-66}}
 +
{{chip
 +
| name                = K6-2/300BNZ-66
 +
| no image            = No
 +
| image              =
 +
| image size          =
 +
| caption            =
 +
| designer            = AMD
 +
| manufacturer        = AMD
 +
| model number        = K6-2/300BNZ-66
 +
| part number        = AMD-K6-2/300BNZ-66
 +
| part number 2      =
 +
| part number 3      =
 +
| part number 4      =
 +
| market              = Mobile
 +
| first announced    = March 22, 1999
 +
| first launched      = March 22, 1999
 +
| last order          =
 +
| last shipment      =
 +
 +
| family              = K6-2
 +
| series              = K6-2 Mobile
 +
| locked              =
 +
| frequency          = 299.99 MHz
 +
| bus type            = FSB
 +
| bus speed          = 66.66 MHz
 +
| bus rate            = 66.66 MT/s
 +
| clock multiplier    = 4.5
 +
| cpuid              = 58C
 +
 +
| microarch          = K6-2
 +
| platform            = Super 7
 +
| chipset            =
 +
| core name          = Chomper Extended
 +
| core family        = 5
 +
| core model          = 8
 +
| core stepping      = 12
 +
| process            = 0.25 µm
 +
| transistors        = 9,300,000
 +
| technology          = CMOS
 +
| die size            = 81 mm²
 +
| word size          = 32 bit
 +
| core count          = 1
 +
| thread count        = 1
 +
| max cpus            = 1
 +
| max memory          = 4 GiB
 +
 +
 +
| power              = 10 W
 +
| v core              = 1.8 V
 +
| v core tolerance    = 0.1 V
 +
| v io                = 3.3675 V
 +
| v io tolerance      = 7%
 +
| sdp                =
 +
| tdp                =
 +
| temp min            =
 +
| temp max            =
 +
| tjunc min          =
 +
| tjunc max          =
 +
| tcase min          = 0 °C
 +
| tcase max          = 85 °C
 +
| tstorage min        = -65 °C
 +
| tstorage max        = 150 °C
 +
 +
| packaging          = Yes
 +
| package 0          = CBGA-360
 +
| package 0 type      = CBGA
 +
| package 0 pins      = 360
 +
| package 0 pitch    = 1.27 mm
 +
| package 0 width    = 25 mm
 +
| package 0 length    = 25 mm
 +
| package 0 height    = 1.1 mm
 +
| socket 0            = BGA-360
 +
| socket 0 type      = BGA
 +
}}
 
'''K6-2/300BNZ-66''' was a {{arch|32}} [[x86]] {{amd|microarchitectures/k6-2|K6-2}}-based mobile microprocessor designed and manufactured in [[1999]] by [[AMD]]. Manufactured using a [[0.25 µm process]], this MPU operated at 300 MHz with a [[FSB]] operating at 66 MHz.
 
'''K6-2/300BNZ-66''' was a {{arch|32}} [[x86]] {{amd|microarchitectures/k6-2|K6-2}}-based mobile microprocessor designed and manufactured in [[1999]] by [[AMD]]. Manufactured using a [[0.25 µm process]], this MPU operated at 300 MHz with a [[FSB]] operating at 66 MHz.
  
 
== Cache ==
 
== Cache ==
 
{{main|amd/microarchitectures/k6-2#Memory_Hierarchy|l1=K6-2 § Cache}}
 
{{main|amd/microarchitectures/k6-2#Memory_Hierarchy|l1=K6-2 § Cache}}
[[L2$]] can be 512 KB to 1 MB, depending on manufacturer and [[motherboard]] model. L2$ is off-chip.
+
[[L2$]] can be 512 KiB to 1 MiB, depending on manufacturer and [[motherboard]] model. L2$ is off-chip.
 
{{cache info
 
{{cache info
|l1i cache=32 KB
+
|l1i cache=32 KiB
|l1i break=1x32 KB
+
|l1i break=1x32 KiB
 
|l1i desc=2-way set associative
 
|l1i desc=2-way set associative
 
|l1i extra=
 
|l1i extra=
|l1d cache=32 KB
+
|l1d cache=32 KiB
|l1d break=1x32 KB
+
|l1d break=1x32 KiB
 
|l1d desc=2-way set associative
 
|l1d desc=2-way set associative
 
|l1d extra=
 
|l1d extra=
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== Features ==
 
== Features ==
{{mpu features
+
{{x86 features
 
| mmx  = true
 
| mmx  = true
 
| 3dnow = true
 
| 3dnow = true

Latest revision as of 16:08, 13 December 2017

Edit Values
K6-2/300BNZ-66
General Info
DesignerAMD
ManufacturerAMD
Model NumberK6-2/300BNZ-66
Part NumberAMD-K6-2/300BNZ-66
MarketMobile
IntroductionMarch 22, 1999 (announced)
March 22, 1999 (launched)
ShopAmazon
General Specs
FamilyK6-2
SeriesK6-2 Mobile
Frequency299.99 MHz
Bus typeFSB
Bus speed66.66 MHz
Bus rate66.66 MT/s
Clock multiplier4.5
CPUID58C
Microarchitecture
MicroarchitectureK6-2
PlatformSuper 7
Core NameChomper Extended
Core Family5
Core Model8
Core Stepping12
Process0.25 µm
Transistors9,300,000
TechnologyCMOS
Die81 mm²
Word Size32 bit
Cores1
Threads1
Max Memory4 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Power dissipation10 W
Vcore1.8 V ± 0.1 V
VI/O3.3675 V ± 7%
Tcase0 °C – 85 °C
Tstorage-65 °C – 150 °C

K6-2/300BNZ-66 was a 32-bit x86 K6-2-based mobile microprocessor designed and manufactured in 1999 by AMD. Manufactured using a 0.25 µm process, this MPU operated at 300 MHz with a FSB operating at 66 MHz.

Cache[edit]

Main article: K6-2 § Cache

L2$ can be 512 KiB to 1 MiB, depending on manufacturer and motherboard model. L2$ is off-chip.

Cache Info [Edit Values]
L1I$ 32 KiB
32,768 B
0.0313 MiB
1x32 KiB 2-way set associative
L1D$ 32 KiB
32,768 B
0.0313 MiB
1x32 KiB 2-way set associative

Graphics[edit]

This SoC has no integrated graphics processing unit.

Features[edit]

  • Auto-power down state
  • Stop clock state

Documents[edit]

DataSheet[edit]

base frequency299.99 MHz (0.3 GHz, 299,990 kHz) +
bus rate66.66 MT/s (0.0667 GT/s, 66,660 kT/s) +
bus speed66.66 MHz (0.0667 GHz, 66,660 kHz) +
bus typeFSB +
clock multiplier4.5 +
core count1 +
core family5 +
core model8 +
core nameChomper Extended +
core stepping12 +
core voltage1.8 V (18 dV, 180 cV, 1,800 mV) +
core voltage tolerance0.1 V +
cpuid58C +
designerAMD +
die area81 mm² (0.126 in², 0.81 cm², 81,000,000 µm²) +
familyK6-2 +
first announcedMarch 22, 1999 +
first launchedMarch 22, 1999 +
full page nameamd/k6-2/k6-2-300bnz-66 +
instance ofmicroprocessor +
io voltage3.368 V (33.675 dV, 336.75 cV, 3,367.5 mV) +
io voltage tolerance7% +
l1d$ description2-way set associative +
l1d$ size32 KiB (32,768 B, 0.0313 MiB) +
l1i$ description2-way set associative +
l1i$ size32 KiB (32,768 B, 0.0313 MiB) +
ldateMarch 22, 1999 +
manufacturerAMD +
market segmentMobile +
max case temperature358.15 K (85 °C, 185 °F, 644.67 °R) +
max cpu count1 +
max memory4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max storage temperature423.15 K (150 °C, 302 °F, 761.67 °R) +
microarchitectureK6-2 +
min case temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature208.15 K (-65 °C, -85 °F, 374.67 °R) +
model numberK6-2/300BNZ-66 +
nameK6-2/300BNZ-66 +
part numberAMD-K6-2/300BNZ-66 +
platformSuper 7 +
power dissipation10 W (10,000 mW, 0.0134 hp, 0.01 kW) +
process250 nm (0.25 μm, 2.5e-4 mm) +
seriesK6-2 Mobile +
smp max ways1 +
technologyCMOS +
thread count1 +
transistor count9,300,000 +
word size32 bit (4 octets, 8 nibbles) +