From WikiChip
Editing die
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Latest revision | Your text | ||
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== Overview == | == Overview == | ||
− | The | + | The die is the final product of the [[fabrication process]]. A fully processed wafer will under [[singulation]] following [[wafer probing|probing]]. Depending on the application, the die may be shipped to an assembly/packaging plant where it will undergo [[encapsulation]], producing the final chip that ships to customers. |
=== Known good die === | === Known good die === |