Editing amd/k6-2/k6-2-300bnz

{{amd title|AMD-K6-2/300BNZ}}
{{chip
| name                = K6-2/300BNZ
| no image            = No
| image               = 
| image size          = 
| caption             = 
| designer            = AMD
| manufacturer        = AMD
| model number        = K6-2/300BNZ
| part number         = AMD-K6-2/300BNZ
| part number 2       = 
| part number 3       = 
| part number 4       = 
| market              = Mobile
| first announced     = March 22, 1999
| first launched      = March 22, 1999
| last order          = 
| last shipment       = 

| family              = K6-2
| series              = K6-2 Mobile
| locked              = 
| frequency           = 299.99 MHz
| bus type            = FSB
| bus speed           = 99.99 MHz
| bus rate            = 99.99 MT/s
| clock multiplier    = 3
| cpuid               = 58C

| microarch           = K6-2
| platform            = Super 7
| chipset             = 
| core name           = Chomper Extended
| core family         = 5
| core model          = 8
| core stepping       = 12
| process             = 0.25 µm
| transistors         = 9,300,000
| technology          = CMOS
| die size            = 81 mm²
| word size           = 32 bit
| core count          = 1
| thread count        = 1
| max cpus            = 1
| max memory          = 4 GiB


| power               = 10 W
| v core              = 1.8 V
| v core tolerance    = 0.1 V
| v io                = 3.3675 V
| v io tolerance      = 7%
| sdp                 = 
| tdp                 = 
| temp min            = 
| temp max            = 
| tjunc min           = 
| tjunc max           = 
| tcase min           = 0 °C
| tcase max           = 85 °C
| tstorage min        = -65 °C
| tstorage max        = 150 °C

| packaging           = Yes
| package 0           = CBGA-360
| package 0 type      = CBGA
| package 0 pins      = 360
| package 0 pitch     = 1.27 mm
| package 0 width     = 25 mm
| package 0 length    = 25 mm
| package 0 height    = 1.1 mm
| socket 0            = BGA-360
| socket 0 type       = BGA
}}
'''K6-2/300BNZ''' was a {{arch|32}} [[x86]] {{amd|microarchitectures/k6-2|K6-2}}-based mobile microprocessor designed and manufactured in [[1999]] by [[AMD]]. Manufactured using a [[0.25 µm process]], this MPU operated at 300 MHz with a [[FSB]] operating at 100 MHz.

== Cache ==
{{main|amd/microarchitectures/k6-2#Memory_Hierarchy|l1=K6-2 § Cache}}
[[L2$]] can be 512 KiB to 1 MiB, depending on manufacturer and [[motherboard]] model. L2$ is off-chip.
{{cache info
|l1i cache=32 KiB
|l1i break=1x32 KiB
|l1i desc=2-way set associative
|l1i extra=
|l1d cache=32 KiB
|l1d break=1x32 KiB
|l1d desc=2-way set associative
|l1d extra=
|l2 cache=
|l2 break=
|l2 desc=
|l2 extra=
|l3 cache=
|l3 break=
|l3 desc=
|l3 extra=
}}

== Graphics ==
This SoC has no integrated graphics processing unit.

== Features ==
{{mpu features
| mmx   = true
| 3dnow = true
}}
* Auto-power down state
* Stop clock state

== Documents ==

=== DataSheet ===
* [[:File:Mobile AMD-K6-2 Processor Data Sheet (May, 2000).pdf|Mobile AMD-K6-2 Processor Data Sheet]]; Publication #21896 Revision E/0, May 2000
base frequency	299.99 MHz (0.3 GHz, 299,990 kHz) +
bus rate	99.99 MT/s (0.1 GT/s, 99,990 kT/s) +
bus speed	99.99 MHz (0.1 GHz, 99,990 kHz) +
bus type	FSB +
clock multiplier	3 +
core count	1 +
core family	5 +
core model	8 +
core name	Chomper Extended +
core stepping	12 +
core voltage	1.8 V (18 dV, 180 cV, 1,800 mV) +
core voltage tolerance	0.1 V +
cpuid	58C +
designer	AMD +
die area	81 mm² (0.126 in², 0.81 cm², 81,000,000 µm²) +
family	K6-2 +
first announced	March 22, 1999 +
first launched	March 22, 1999 +
full page name	amd/k6-2/k6-2-300bnz +
instance of	microprocessor +
io voltage	3.368 V (33.675 dV, 336.75 cV, 3,367.5 mV) +
io voltage tolerance	7% +
l1d$ description	2-way set associative +
l1d$ size	32 KiB (32,768 B, 0.0313 MiB) +
l1i$ description	2-way set associative +
l1i$ size	32 KiB (32,768 B, 0.0313 MiB) +
ldate	March 22, 1999 +
manufacturer	AMD +
market segment	Mobile +
max case temperature	358.15 K (85 °C, 185 °F, 644.67 °R) +
max cpu count	1 +
max memory	4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max storage temperature	423.15 K (150 °C, 302 °F, 761.67 °R) +
microarchitecture	K6-2 +
min case temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature	208.15 K (-65 °C, -85 °F, 374.67 °R) +
model number	K6-2/300BNZ +
name	K6-2/300BNZ +
part number	AMD-K6-2/300BNZ +
platform	Super 7 +
power dissipation	10 W (10,000 mW, 0.0134 hp, 0.01 kW) +
process	250 nm (0.25 μm, 2.5e-4 mm) +
series	K6-2 Mobile +
smp max ways	1 +
technology	CMOS +
thread count	1 +
transistor count	9,300,000 +
word size	32 bit (4 octets, 8 nibbles) +