From WikiChip
Core i3-2310M - Intel
< intel‎ | core i3(Redirected from i3-2310M)

Edit Values
Core i3-2310M
General Info
DesignerIntel
ManufacturerIntel
Model Numberi3-2310M
Part NumberFF8062700999405,
AV8062700999605
S-SpecSR04R, SR04S
MarketMobile
IntroductionFebruary, 2011 (announced)
February, 2011 (launched)
Release Price$225
ShopAmazon
General Specs
FamilyCore i3
Seriesi3-2000
LockedYes
Frequency2,100 MHz
Bus typeDMI 2.0
Bus rate4 × 5 GT/s
Clock multiplier21
CPUID0x206A7
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureSandy Bridge
PlatformSandy Bridge M
ChipsetCougar Point
Core NameSandy Bridge M
Core Family6
Core Model42
Core SteppingJ1
Process32 nm
Transistors624,000,000
TechnologyCMOS
Die149 mm²
Word Size64 bit
Cores2
Threads4
Max Memory16 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Power (idle)3.1 W
Vcore0.3 V-1.52 V
TDP35 W
Tjunction0 °C – 100 °C
Tstorage-25 °C – 125 °C
Packaging
PackageFCBGA-1023 (BGA)
Dimension31 mm x 24 mm
Pitch0.65 mm
Contacts1023
PackagerPGA988B (PGA)
Dimension37.5 mm x 37.5 mm
Pitch1 mm
Contacts988
SocketSocket G2

Core i3-2310M is a dual-core embedded entry-level performance mobile x86 microprocessor introduced by Intel in early 2011. Fabricated on a 32 nm process based on the Sandy Bridge microarchitecture, this processor operates at 2.1 GHz with a TDP of 35 Watts. The i3-2310M supports up to 16 GiB of dual-channel DDR3-1333 memory and incorporates Intel's HD Graphics 3000 integrated graphics operating at 650 MHz with a burst frequency of 1.1 GHz.

Cache[edit]

Main article: Sandy Bridge § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
131,072 B
0.125 MiB
L1I$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associative 
L1D$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associativewrite-back
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  2x256 KiB8-way set associativewrite-back
L3$3 MiB
3,072 KiB
3,145,728 B
0.00293 GiB
  2x1.5 MiB12-way set associativewrite-back

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3-1333, DDR3-1066
Supports ECCNo
Max Mem16 GiB
Controllers1
Channels2
Max Bandwidth19.87 GiB/s
20,346.88 MiB/s
21.335 GB/s
21,335.25 MB/s
0.0194 TiB/s
0.0213 TB/s
Bandwidth
Single 9.93 GiB/s
Double 19.87 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 2.0
Max Lanes: 16
Configuration: 1x16, 2x8, 1x8+2x4

Wireless[edit]

Antu network-wireless-connected-100.svgWireless Communications
Cellular
4G
WiMAX Yes

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUHD Graphics 3000
DesignerIntelDevice ID0x116
Execution Units12Max Displays2
Frequency650 MHz
0.65 GHz
650,000 KHz
Burst Frequency1,100 MHz
1.1 GHz
1,100,000 KHz
OutputDP, eDP, HDMI, SDVO, CRT
Standards
DirectX10.1
OpenGL3.1
DP1.1
eDP1.1
HDMI1.4
Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Flexible Display Interface (FDI)
Intel Clear Video HD

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
CLMULCarry-less Multiplication Extension
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
EISTEnhanced SpeedStep Technology
VT-xVT-x (Virtualization)
EPTExtended Page Tables (SLAT)
Flex MemoryFlex Memory Access
FMAFast Memory Access (w\ GMCH)
MWTMy WiFi Technology
ATTAnti-Theft Technology
IPTIdentity Protection Technology
Retrieved from "https://en.wikichip.org/w/index.php?title=intel/core_i3/i3-2310m&oldid=70505"
Facts about "Core i3-2310M - Intel"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Core i3-2310M - Intel#package + and Core i3-2310M - Intel#pcie +
base frequency2,100 MHz (2.1 GHz, 2,100,000 kHz) +
bus links4 +
bus rate5,000 MT/s (5 GT/s, 5,000,000 kT/s) +
bus typeDMI 2.0 +
chipsetCougar Point +
clock multiplier21 +
core count2 +
core family6 +
core model42 +
core nameSandy Bridge M +
core steppingJ1 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.3 V (3 dV, 30 cV, 300 mV) +
cpuid0x206A7 +
designerIntel +
device id0x116 +
die area149 mm² (0.231 in², 1.49 cm², 149,000,000 µm²) +
familyCore i3 +
first announcedFebruary 2011 +
first launchedFebruary 2011 +
full page nameintel/core i3/i3-2310m +
has 4g supporttrue +
has advanced vector extensionstrue +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Hyper-Threading Technology +, Enhanced SpeedStep Technology +, Intel VT-x +, Extended Page Tables +, Flex Memory Access +, My WiFi Technology + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel identity protection technology supporttrue +
has intel my wifi technology supporttrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has wimax supporttrue +
instance ofmicroprocessor +
integrated gpuHD Graphics 3000 +
integrated gpu base frequency650 MHz (0.65 GHz, 650,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units12 +
integrated gpu max frequency1,100 MHz (1.1 GHz, 1,100,000 KHz) +
isax86-64 +
isa familyx86 +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description8-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description8-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description12-way set associative +
l3$ size3 MiB (3,072 KiB, 3,145,728 B, 0.00293 GiB) +
ldateFebruary 2011 +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth19.87 GiB/s (20,346.88 MiB/s, 21.335 GB/s, 21,335.25 MB/s, 0.0194 TiB/s, 0.0213 TB/s) +
max memory channels2 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureSandy Bridge +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberi3-2310M +
nameCore i3-2310M +
packageFCBGA-1023 + and rPGA988B +
part numberFF8062700999405 + and AV8062700999605 +
platformSandy Bridge M +
power dissipation (idle)3.1 W (3,100 mW, 0.00416 hp, 0.0031 kW) +
process32 nm (0.032 μm, 3.2e-5 mm) +
release price$ 225.00 (€ 202.50, £ 182.25, ¥ 23,249.25) +
s-specSR04R + and SR04S +
seriesi3-2000 +
smp max ways1 +
socketSocket G2 +
supported memory typeDDR3-1333 + and DDR3-1066 +
tdp35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count4 +
transistor count624,000,000 +
word size64 bit (8 octets, 16 nibbles) +