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The final die yield is the compounded yield of all the independent steps that are required to produce a functional die. Those include:
 
The final die yield is the compounded yield of all the independent steps that are required to produce a functional die. Those include:
  
* [[Wafer Yield]] (Y<sub>W</sub>) - fraction of wafers that are not scrapped
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* [[Wafer Yield]] (Y<sub>W</sub>) - fraction of wafers that are not scraped
* [[Die Yield]] or wafer sort yield (Y<sub>D</sub>) - fraction of dies that are not scrapped
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* [[Die Yield]] or wafer sort yield (Y<sub>D</sub>) - fraction of dies that are not scraped
 
* [[Assembly Yield]] (Y<sub>A</sub>) - fraction of chips that are not scrapped during the packaging stage
 
* [[Assembly Yield]] (Y<sub>A</sub>) - fraction of chips that are not scrapped during the packaging stage
 
* [[Burn-in Yield]] (Y<sub>B</sub>) - fraction of chips that pass [[burn-in]]
 
* [[Burn-in Yield]] (Y<sub>B</sub>) - fraction of chips that pass [[burn-in]]

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