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Difference between revisions of "qualcomm/snapdragon 800/855"
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* [[:File:snapdragon-855-mobile-platform-product-brief.pdf|Product Brief]]
 
* [[:File:snapdragon-855-mobile-platform-product-brief.pdf|Product Brief]]
 
* [[:File:snapdragon-855-entertainment-deep-dive-hiren-bhinde.pdf|Entertainment Deep Dive Presentation]]
 
* [[:File:snapdragon-855-entertainment-deep-dive-hiren-bhinde.pdf|Entertainment Deep Dive Presentation]]
* [[:File:snapdragon-855-deep-dives-intro-keith-kressin.pdf|Entertainment Deep Dive Presentation]]
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* [[:File:snapdragon-855-deep-dives-intro-keith-kressin.pdf|Deep Dive Presentation]]

Revision as of 14:18, 18 December 2018

Edit Values
Snapdragon 855
sd 855 (front).png
General Info
DesignerQualcomm,
ARM Holdings
ManufacturerTSMC
MarketMobile
IntroductionDecember 4, 2018 (announced)
Q1, 2019 (launched)
General Specs
FamilySnapdragon 800
Series800
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A76, Cortex-A55
Core NameKryo 485 Gold, Kryo 485 Silver
Process7 nm
TechnologyCMOS
Word Size64 bit
Cores8
Threads8
Max Memory16 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Packaging
sd 855 (back).png
Succession
Block Diagram

Snapdragon 855 is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2018. Fabricated on TSMC's 7nm process, the 855 features four Kryo 485 Silver high-efficiency cores operating at 1.8 GHz along with three high-performance Kryo 485 Gold operating at 2.42 GHz and another higher-performance Kryo 485 Gold core operating at 2.84 GHz. The Snapdragon 855 integrates the Adreno 640 GPU operation at ? MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to 16 GiB of quad-channel LPDDR4X-4266 memory.

The Snapdragon 855 can be paired with Qualcomm's X50 5G modem (an external chip) and an RF front-end interface chip (RFFE) to bring 5G NR, sub-6 GHz and mmWave, support.

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-4266
Supports ECCNo
Max Mem16 GiB
Frequency2133 MHz
Controllers1
Channels8
Width16 bit
Max Bandwidth31.79 GiB/s
55.315 GB/s
32,552.96 MiB/s
0.031 TiB/s
0.0341 TB/s
Bandwidth
Single 7.95 GiB/s
Double 15.89 GiB/s
Quad 31.79 GiB/s

DSP

This chip features Qualcomm's Hexagon 685 DSP.

Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUAdreno 640 GPU
DesignerQualcomm
Max Displays2
Frequency? MHz
"? MHz" is not a number.
Output

Standards
DirectX12
OpenCL2.0
OpenGL ES3.2
Vulkan1.1
  • Codec: H.265 (HEVC), H.264 (AVC), HDR10, HDR10+, HLG, VP8, VP9
  • HDR Playback Codec support for HDR10+, HDR10, HLG and Dolby Vision
  • Volumetric VR video playback
  • 8K 360 VR video playback

Camera

  • ISP
    • Qualcomm Spectra 380 image signal processor
      • Dual 14-bit CV-ISPs
      • Hardware accelerator for computer vision (CV-ISP)
    • Up to 20 MP dual camera
    • Up to 32 MP single camera
  • Photo Capture: HEIF photo capture
  • Video Capture:
    • Rec. 2020 color gamut video capture
    • Up to 10-bit color depth video capture
    • Slow motion video capture up to 720p at 480fps,HEVC Video Capture

Connectivity

  • X24 LTE modem
    • LTE Category 20
    • Downlink:
      • 2 Gbps peak
      • 7x20 MHz carrier aggregation
      • Up to 256-QAM
      • Up to 4x4 MIMO on five carriers
      • Full-Dimension MIMO (FD-MIMO)
      • Maximum 20 spatial streams
    • Uplink:
      • 316 Mbps peak
      • 3x20 MHz carrier aggregation
      • Up to 2x 106Mbps LTE streams
      • Up to 256-QAM
      • Uplink data compression
  • LTE FDD, LTE TDD including CBRS support, LAA, LTE Broadcast, WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
  • WiFi
    • Standards: 802.11ad, 802.11ac Wave 2, 802.11a/b/g, 802.11n
    • Spectral Bands: 2.4 GHz, 5 GHz, 60 GHz
  • Bluetooth
    • Bluetooth 5.0
    • 2 Mbps

Location

  • Systems: GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, Dual frequency GNSS

Documents

back imageFile:sd 855 (back).png +
core count8 +
core nameKryo 485 Gold + and Kryo 485 Silver +
designerQualcomm + and ARM Holdings +
dspHexagon 690 DSP +
familySnapdragon 800 +
first announcedDecember 4, 2018 +
first launchedJanuary 2019 +
full page namequalcomm/snapdragon 800/855 +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuAdreno 640 GPU +
integrated gpu designerQualcomm +
isaARMv8 +
isa familyARM +
ldateJanuary 2019 +
main imageFile:sd 855 (front).png +
manufacturerTSMC +
market segmentMobile +
max cpu count1 +
max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth31.79 GiB/s (55.315 GB/s, 32,552.96 MiB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels8 +
microarchitectureCortex-A76 + and Cortex-A55 +
nameSnapdragon 855 +
process7 nm (0.007 μm, 7.0e-6 mm) +
series800 +
smp max ways1 +
supported memory typeLPDDR4X-4266 +
technologyCMOS +
thread count8 +
word size64 bit (8 octets, 16 nibbles) +