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Latest revision Your text
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| last shipment      =  
 
| last shipment      =  
 
| release price      =  
 
| release price      =  
−
 
−
| family              = MSM6xxx
 
−
| series              = MSM
 
−
| locked              = Yes
 
−
| frequency          = 40 MHz
 
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| bus type            = AMBA 2
 
−
| bus speed          =
 
−
| bus rate            =
 
−
| bus links          =
 
−
| clock multiplier    =
 
−
 
−
| microarch          = ARM7
 
−
| platform            =
 
−
| chipset            = MSM6xxx
 
−
| core name          = ARM7TDMI
 
−
| core family        =
 
−
| core model          =
 
−
| core stepping      =
 
−
| process            = 180 nm
 
−
| transistors        =
 
−
| technology          = CMOS
 
−
| die area            = <!-- XX mm² -->
 
−
| die width          =
 
−
| die length          =
 
−
| word size          =
 
−
| core count          = 1
 
−
| thread count        = 1
 
−
| max cpus            = 1
 
−
| max memory          = 4 GiB
 
−
| max memory addr    = 0xFFFFFFFF
 
−
 
−
| electrical          = <!-- put Yes if electrical info is added -->
 
−
| power              = <!-- power consumption  -->
 
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| v core              =
 
−
| v core tolerance    =
 
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| v io                =
 
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| v io tolerance      =
 
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| sdp                =
 
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| tdp                =
 
−
| tdp typical        =
 
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| ctdp down          =
 
−
| ctdp down frequency =
 
−
| ctdp up            =
 
−
| ctdp up frequency  =
 
−
| temp min            = <!-- use TJ/TC whenever possible instead -->
 
−
| temp max            =
 
−
| tjunc min          = <!-- .. °C -->
 
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| tjunc max          =
 
−
| tcase min          =
 
−
| tcase max          =
 
−
| tstorage min        =
 
−
| tstorage max        =
 
−
| tambient min        =
 
−
| tambient max        =
 
−
 
−
| packaging          = Yes
 
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| package 0          = FBGA-208
 
−
| package 0 type      = FBGA
 
−
| package 0 pins      = 208
 
−
| package 0 pitch    = 0.8 mm
 
−
| package 0 width    = 15 mm
 
−
| package 0 length    = 15 mm
 
−
| package 0 height    = 0.7 mm
 
 
}}
 
}}
 
'''MSM6200''' is a {{arch|32}} [[ARM]] [[system-on-chip]] with [[3G]] wireless capabilities developed by [[Qualcomm]] and introduced in [[2002]] for the mobile market. This SoC was part of the {{qualcomm|MSM6xxx}} [[part of::Value Platform]] offering support for features such as basic color screens, position-location services, music, ringtones and voice recognition features.
 
'''MSM6200''' is a {{arch|32}} [[ARM]] [[system-on-chip]] with [[3G]] wireless capabilities developed by [[Qualcomm]] and introduced in [[2002]] for the mobile market. This SoC was part of the {{qualcomm|MSM6xxx}} [[part of::Value Platform]] offering support for features such as basic color screens, position-location services, music, ringtones and voice recognition features.

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Facts about "MSM6200 - Qualcomm"
RDF feed
base frequency40 MHz (0.04 GHz, 40,000 kHz) +
bus typeAMBA 2 +
chipsetMSM6xxx +
core count1 +
core nameARM7TDMI +
designerQualcomm + and ARM Holdings +
dspQDSP4000 +
dsp base frequency40 MHz (0.04 GHz, 40,000 kHz) +
familyMSM6xxx +
first announcedMarch 20, 2001 +
first launchedAugust 2002 +
full page namequalcomm/msm6xxx/msm6200 +
has 2g supporttrue +
has 3g supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has locked clock multipliertrue +
has umts supporttrue +
has wcdma supporttrue +
instance ofmicroprocessor +
l1i$ descriptionNo L1$ +
l1i$ size0 KiB (0 B, 0 MiB) +
ldateAugust 2002 +
main imageFile:msm6200 hires.jpg +
manufacturerTSMC + and IBM +
market segmentMobile + and Embedded +
max cpu count1 +
max memory4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max memory address0xFFFFFFFF +
microarchitectureARM7 +
model numberMSM6200 +
nameQualcomm MSM6200 +
part ofValue Platform +
process180 nm (0.18 μm, 1.8e-4 mm) +
seriesMSM +
smp max ways1 +
technologyCMOS +
thread count1 +