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Difference between revisions of "qualcomm/cloud ai"
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(Cloud AI 100)
(Cloud AI 100)
 
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== Cloud AI 100 ==
 
== Cloud AI 100 ==
{{see also|qualcomm/microarchitectures/cloud ai|l1=Cloud AI 100 μArch}}
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{{see also|qualcomm/microarchitectures/cloud ai 100|l1=Cloud AI 100 μArch}}
 
[[File:qualcomm-cloud-ai-100-2.png|right]]
 
[[File:qualcomm-cloud-ai-100-2.png|right]]
 
Launched in early 2021, the Cloud AI 100 series are the first series of AI inference processors. Fabricated on a [[7-nanometer process]], those processors range from 70 [[TOPS]] / 35 [[FLOPS]] to 400 [[TOPS]] / 200 [[FLOPS]] and are offered in both PCIe cards and M.2 modules (with and without heatsinks).
 
Launched in early 2021, the Cloud AI 100 series are the first series of AI inference processors. Fabricated on a [[7-nanometer process]], those processors range from 70 [[TOPS]] / 35 [[FLOPS]] to 400 [[TOPS]] / 200 [[FLOPS]] and are offered in both PCIe cards and M.2 modules (with and without heatsinks).

Latest revision as of 05:53, 15 September 2021

Qualcomm Cloud AI
Developer Qualcomm
Type System on chips
Introduction Apr 9, 2019 (announced)
March, 2021 (launch)
Architecture Multi-core Neural Processor
ISA Custom
µarch Cloud AI
Process 7 nm
0.007 μm
7.0e-6 mm
Technology CMOS

Cloud AI is a family of neural processors for the edge and data center market designed by Qualcomm and introduced in early 2021.

Cloud AI 100[edit]

See also: Cloud AI 100 μArch
qualcomm-cloud-ai-100-2.png

Launched in early 2021, the Cloud AI 100 series are the first series of AI inference processors. Fabricated on a 7-nanometer process, those processors range from 70 TOPS / 35 FLOPS to 400 TOPS / 200 FLOPS and are offered in both PCIe cards and M.2 modules (with and without heatsinks).

FF PCIe (HHHL) Dual M.2 Dual M.2e (No Heatsink)
Size 68.9 mm x 169.5 mm 46 mm x 110 mm 46 mm x 110 mm
TDP 75 W 15-25 W 15-25 W
Peak Compute
Int8 400 TOPS 200 TOPS 70 TOPS
FP16 200 teraFLOPS 100 teraFLOPS 35 teraFLOPS
Configuration
SRAM 144 MiB 144 MiB 72 MiB
DRAM (w/ECC) 16 GiB LPDDR4x-4266 32 GiB LPDDR4x-4266 8 GiB LPDDR4x-4266
DRAM B/W 136.5 GB/s 136.5 GB/s 68.25 GB/s
Host Interface PCIe Gen 4 (x8) PCIe Gen 4 (x8) PCIe Gen 3 (x4)

Documents[edit]

Facts about "Cloud AI - Qualcomm"
designerQualcomm +
first announcedApril 9, 2019 +
first launchedMarch 2021 +
full page namequalcomm/cloud ai +
instance ofsystem on a chip family +
instruction set architectureCustom +
main designerQualcomm +
microarchitectureCloud AI +
nameQualcomm Cloud AI +
process7 nm (0.007 μm, 7.0e-6 mm) +
technologyCMOS +