From WikiChip
Editing nervana/nnp/nnp-t 1400 (section)

Warning: You are not logged in. Your IP address will be publicly visible if you make any edits. If you log in or create an account, your edits will be attributed to your username, along with other benefits.

This page supports semantic in-text annotations (e.g. "[[Is specified as::World Heritage Site]]") to build structured and queryable content provided by Semantic MediaWiki. For a comprehensive description on how to use annotations or the #ask parser function, please have a look at the getting started, in-text annotation, or inline queries help pages.

Please note that all contributions to WikiChip may be edited, altered, or removed by other contributors. If you do not want your writing to be edited mercilessly, then do not submit it here.
You are also promising us that you wrote this yourself, or copied it from a public domain or similar free resource (see WikiChip:Copyrights for details). Do not submit copyrighted work without permission!

Cancel | Editing help (opens in new window)
back imageFile:spring crest package (back).png +
base frequency1,100 MHz (1.1 GHz, 1,100,000 kHz) +
core count24 +
designerIntel +
die area680 mm² (1.054 in², 6.8 cm², 680,000,000 µm²) +
familyNNP +
first announcedNovember 12, 2019 +
first launchedNovember 12, 2019 +
full page namenervana/nnp/nnp-t 1400 +
has ecc memory supporttrue +
instance ofmicroprocessor +
ldateNovember 12, 2019 +
main imageFile:spring crest package (front).png +
main image captionNPU with 4 HBM2 stacks +
manufacturerTSMC +
market segmentServer +
max memory32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) +
max memory bandwidth1,144.134 GiB/s (1,990.793 GB/s, 1,171,593.296 MiB/s, 1.117 TiB/s, 1.229 TB/s) +
max memory channels32 +
microarchitectureSpring Crest +
model numberNNP-T 1400 +
nameNNP-T 1400 +
packageFCBGA-3325 +
peak flops (half-precision)108,000,000,000,000 FLOPS (108,000,000,000 KFLOPS, 108,000,000 MFLOPS, 108,000 GFLOPS, 108 TFLOPS, 0.108 PFLOPS, 1.08e-4 EFLOPS, 1.08e-7 ZFLOPS) +
power dissipation175 W (175,000 mW, 0.235 hp, 0.175 kW) +
process16 nm (0.016 μm, 1.6e-5 mm) +
seriesNNP-T +
smp interconnectInterChip Link +
smp interconnect links16 +
smp interconnect rate28 GT/s +
supported memory typeHBM2-2400 +
tdp375 W (375,000 mW, 0.503 hp, 0.375 kW) +
technologyCMOS +
transistor count27,000,000,000 +