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[[File:nnp-l-1000 announcement.png|thumb|right|NNP T-1000]]
 
[[File:nnp-l-1000 announcement.png|thumb|right|NNP T-1000]]
 
{{main|nervana/microarchitectures/spring_crest|l1=Spring Crest µarch}}
 
{{main|nervana/microarchitectures/spring_crest|l1=Spring Crest µarch}}
Launched in late 2019, second-generation NNP-Ts are branded as the NNP T-1000 series and are the first chips to be productized. Fabricated [[TSMC]]'s [[16 nm process]] based on the {{nervana|Spring Crest|Spring Crest microarchitecture|l=arch}}, those chips feature a number of enhancements and refinments over the prior generation including a shift from [[Flexpoint]] to [[Bfloat16]] and considerable performance uplift. Intel claims that these chips have about 3-4x the training performance of first generation. All NNP-T 1000 chips come with 32 GiB of four [[HBM2]] stacks in a [[CoWoS]] package and come in two form factors: [[PCIe Gen 3]] and an [[OCP OAM]] [[accelerator card]].
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Second-generation NNP-Ts are branded as the NNP T-1000 series and are the first chips to be productized. Fabricated [[TSMC]]'s [[16 nm process]] based on the {{nervana|Spring Crest|Spring Crest microarchitecture|l=arch}}, those chips feature a number of enhancements and refinments over the prior generation including a shift from [[Flexpoint]] to [[Bfloat16]]. Intel claims that these chips have about 3-4x the training performance of first generation. Those chips come with 32 GiB of four [[HBM2]] stacks and are [[packaged]] in two forms - [[PCIe x16 Gen 3 Card]] and an [[OCP OAM]].
 
[[File:spring_crest_ocp_board_(front).png|right|thumb|NNP-T 1400 [[OAM Module]].]]
 
[[File:spring_crest_ocp_board_(front).png|right|thumb|NNP-T 1400 [[OAM Module]].]]
  
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[[File:ai hw summit supermicro ref pod rack.jpeg|right|thumb|POD Rack]]
 
[[File:ai hw summit supermicro ref pod rack.jpeg|right|thumb|POD Rack]]
 
Along with the launch of the NNP-T 1000 series, Intel also introduced the POD reference design. Those systems were intended for large-scale out systems for the processing of very large neural networks. The POD reference design featured 10 racks with 6 nodes per rack. Each of the nodes features eight interconnected OAM cards, producing a system with a total of 480 NNP-Ts.
 
Along with the launch of the NNP-T 1000 series, Intel also introduced the POD reference design. Those systems were intended for large-scale out systems for the processing of very large neural networks. The POD reference design featured 10 racks with 6 nodes per rack. Each of the nodes features eight interconnected OAM cards, producing a system with a total of 480 NNP-Ts.
 
  
 
:[[File:ai hw summit supermicro ref pod.jpeg|500px]]
 
:[[File:ai hw summit supermicro ref pod.jpeg|500px]]

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designerIntel +
first announcedMay 23, 2018 +
first launched2019 +
full page namenervana/nnp +
instance ofintegrated circuit family +
main designerIntel +
manufacturerIntel + and TSMC +
nameNNP +
packagePCIe x16 Gen 3 Card +, OCP OAM + and M.2 +
process28 nm (0.028 μm, 2.8e-5 mm) +, 16 nm (0.016 μm, 1.6e-5 mm) + and 10 nm (0.01 μm, 1.0e-5 mm) +
technologyCMOS +