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Difference between revisions of "mediatek/helio/mt6799"
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* [[used by::Meizu Pro 7 Plus]]
 
* [[used by::Meizu Pro 7 Plus]]
 
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{{expand list}}
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== Die ==
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* [[10 nm process]]
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:[[File:x30 die shot.png|500px]]
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== Bibliography ==
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* Mair, Hugh, et al. "3.4 A 10nm FinFET 2.8 GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2017 IEEE International. IEEE, 2017.

Latest revision as of 16:22, 29 December 2018

Edit Values
MediaTek Helio X30
General Info
DesignerMediaTek,
ARM Holdings
ManufacturerTSMC
Model NumberHelio X30
Part NumberMT6799
MarketMobile, Embedded
IntroductionSeptember 26, 2016 (announced)
February 27, 2017 (launched)
General Specs
FamilyHelio
SeriesHelio X
Frequency2,500 MHz, 2,200 MHz, 1,900 MHz
Bus typeAMBA 4 AXI
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53, Cortex-A73, Cortex-A35
Core NameCortex-A35, Cortex-A53, Cortex-A73
Process10 nm
TechnologyCMOS
Word Size64 bit
Cores10
Threads10
Max Memory8 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)

Helio X30 (MT6799) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and launched in early 2017. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports up to 8 GiB of quad-channel LPDDR4X-3732 memory. This SoC also incorporates a PowerVR GT7400 Plus IGP operating at 800 MHz. The chip has a modem supporting LTE User Equipment (UE) category 10.

Architecture[edit]

The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.

The three clusters are designed as a modified big.LITTLE configuration.

Cache[edit]

Main articles: Cortex-A53 § Cache and Cortex-A73 § Cache
New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-3732
Supports ECCNo
Max Mem8 GiB
Controllers1
Channels4
Width16 bit
Max Bandwidth27.81 GiB/s
28,477.44 MiB/s
29.861 GB/s
29,860.76 MB/s
0.0272 TiB/s
0.0299 TB/s
Bandwidth
Single 6.95 GiB/s
Double 13.9 GiB/s
Quad 27.81 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0, 3.0
Ports8
UART
GP I/OYes


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR GT7400 Plus
DesignerImagination Technologies
Frequency800 MHz
0.8 GHz
800,000 KHz
OutputDSI
Max Resolution
DSI3840x2160
Standards
Direct3D11.2
OpenGL3.3
OpenCL2.0
OpenGL ES3.2
Vulkan1.0

Wireless[edit]

Antu network-wireless-connected-100.svgWireless Communications
Wi-Fi
WiFi
802.11acYes
Cellular
2G
CSD Yes
GSM Yes
GPRS Yes
EDGE Yes
3G
UMTS
TD-SCDMAYes
DC-HSDPAYes
HSUPAYes
CDMA2000
1XYes
1xEV-DOYes
4G
LTE Advanced
E-UTRANYes
UE Cat10

Image[edit]

  • Integrated image signal processor supports 28 MP
  • Supports image stabilization
  • Supports video stabilization
  • Supports noise reduction
  • Supports lens shading correction
  • Supports AE/AWB/AF
  • Supports edge enhancement
  • Supports face detection and visual tracking
  • Hardware JPEG encoder

Video[edit]

  • Video encoding 4K2K @ 30fps with H.265 and HDR
  • Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9

Audio[edit]

  • Audio content sampling rates 8kHz to 192kHz
  • Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
  • I2S, PCM
  • Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
  • Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
  • 7.1 channel MHL output

Utilizing devices[edit]

  • Meizu Pro 7
  • Meizu Pro 7 Plus

This list is incomplete; you can help by expanding it.

Die[edit]

x30 die shot.png

Bibliography[edit]

  • Mair, Hugh, et al. "3.4 A 10nm FinFET 2.8 GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2017 IEEE International. IEEE, 2017.
Retrieved from "https://en.wikichip.org/w/index.php?title=mediatek/helio/mt6799&oldid=85359"
Facts about "Helio X30 (MT6799) - MediaTek"
RDF feed
base frequency2,500 MHz (2.5 GHz, 2,500,000 kHz) +, 2,200 MHz (2.2 GHz, 2,200,000 kHz) + and 1,900 MHz (1.9 GHz, 1,900,000 kHz) +
bus typeAMBA 4 AXI +
core count10 +
core nameCortex-A35 +, Cortex-A53 + and Cortex-A73 +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedSeptember 26, 2016 +
first launchedFebruary 27, 2017 +
full page namemediatek/helio/mt6799 +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has cdma2000 1x supporttrue +
has cdma2000 1xev-do supporttrue +
has cdma2000 supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuPowerVR GT7400 Plus +
integrated gpu base frequency800 MHz (0.8 GHz, 800,000 KHz) +
integrated gpu designerImagination Technologies +
isaARMv8 +
isa familyARM +
ldateFebruary 27, 2017 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max memory8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory bandwidth27.81 GiB/s (28,477.44 MiB/s, 29.861 GB/s, 29,860.76 MB/s, 0.0272 TiB/s, 0.0299 TB/s) +
max memory channels4 +
microarchitectureCortex-A53 +, Cortex-A73 + and Cortex-A35 +
model numberHelio X30 +
nameMediaTek Helio X30 +
part numberMT6799 +
process10 nm (0.01 μm, 1.0e-5 mm) +
seriesHelio X +
smp max ways1 +
supported memory typeLPDDR4X-3732 +
technologyCMOS +
thread count10 +
used byMeizu Pro 7 + and Meizu Pro 7 Plus +
user equipment category10 +
word size64 bit (8 octets, 16 nibbles) +