Difference between revisions of "intel/process"

Revision as of 05:46, 11 May 2017

This article details Intel's Semiconductor Process Technology.

Timeline

1 µm vs 500 nm yield

Ramps from 1 µm to 65 nm

SRAM test chips from 130 nm to 45 nm

Year	Process	Node	MLayers	µarchs
	CHMOS I	3 µm	1		T_ox	70 nm	Gate Dielectric
					V_dd	5 V	SRAM	1120 µm²
					L_g	3.0 µm
					CPP	7 µm	MMP	11 µm
	CHMOS II	2 µm	1		T_ox	40 nm	Gate Dielectric
					V_dd	5 V	SRAM (HD)	1740 µm²
					L_g	2.0 µm
					CPP	5.6 µm	MMP	8 µm
1982	P646 (CHMOS III)	1.5 µm	1	80286, 80386	T_ox	25 nm	Gate Dielectric	Si₂N₂O
					V_dd	5 V	SRAM (HD)	951.7 µm²
					L_g	1.5 µm
					CPP	4.0 µm	MMP	6.4 µm
1987	P648	1.0 µm	2	80486	L_g	1,000 nm
					T_ox	? nm	Gate Dielectric
					V_dd	? V
1989	P650	0.8 µm	3	80486	L_g	800 nm
					T_ox	? nm	Gate Dielectric
					V_dd	? V
1993	P852	0.5 µm	4	P5	L_g	500 nm
					T_ox	8.0 nm	Gate Dielectric
					V_dd	3.3 V
1995	P854	0.35 µm	4	P6	L_g	350 nm
					T_ox	5.2 nm	Gate Dielectric
					V_dd	2.5 V
1997	P856 P856.5	0.25 µm	5	P6	L_g	200 nm
					T_ox	3.1 nm	Gate Dielectric	SiO₂
					V_dd	1.8 V
1999	P858	0.18 µm	6	NetBurst	L_g	130 nm
					T_ox	2.0 nm	Gate Dielectric	SiO₂
					V_dd	1.6 V
2001	P860	0.13 µm	6	Pentium M	L_g	70 nm
					T_ox	1.4 nm	Gate Dielectric	SiO₂
					V_dd	1.4 V
					SRAM (HD)	2.45 µm²
2003	P1262	90 nm	7	Pentium M	L_g	50 nm
					T_ox	1.2 nm	Gate Dielectric	SiO₂
					V_dd	1.2 V
					SRAM (HD)	1.00 µm²
2005	P1264	65 nm	8	Core, Modified Pentium M	T_ox		Gate Dielectric	SiO₂
					V_dd		SRAM	0.570 µm²
					L_g	35 nm
					CPP	220 nm	MMP	210 nm
2007	P1266	45 nm	9	Penryn, Nehalem	T_ox		Gate Dielectric	High-κ
					V_dd		SRAM	0.346 µm²
					L_g	25 nm
					CPP	160 nm	MMP	180 nm
2009	P1268	32 nm	10	Westmere, Sandy Bridge	T_ox		Gate Dielectric	High-κ
					V_dd		SRAM	0.148 µm²
					L_g	30 nm
					CPP	112.5 nm	MMP	112.5 nm
2011	P1270	22 nm	11	Ivy Bridge, Haswell	T_ox		Gate Dielectric	High-κ
					V_dd		SRAM	0.092 µm²
					L_g	26 nm
					CPP	90 nm	MMP	80 nm
2014	P1272	14 nm	11	Broadwell, Skylake, Kaby Lake, Coffee Lake	T_ox		Gate Dielectric	High-κ
					V_dd		SRAM	0.0499 µm²
					L_g	20 nm
					CPP	70 nm	MMP	52 nm
2017	P1274	10 nm		Cannonlake, Icelake, Tigerlake	T_ox		Gate Dielectric	High-κ
					V_dd		SRAM	0.0312 µm²
					L_g	18 nm ?
					CPP	54 nm	MMP	36 nm
2019	P1276	7 nm
2022	P1278	5 nm

@@ Line 83: / Line 83: @@
 {{intel proc tech |year=2005 |name=P1264 |mlayers=8 |node=65 nm
    |archs=Core, Modified Pentium M
-   |a1=L<sub>g</sub>  |d1=35 nm
+   |a1=T<sub>ox</sub> |d1=           |a12=Gate Dielectric |d12=SiO<sub>2</sub>
-   |a2=T<sub>ox</sub> |d2=? nm |a22=Gate Dielectric |d22=SiO<sub>2</sub>
+   |a2=V<sub>dd</sub> |d2=           |a22=SRAM            |d22=0.570 µm²
-   |a3=V<sub>dd</sub> |d3=? V
+   |a3=L<sub>g</sub>  |d3=35 nm
-   |a4=SRAM (HD)      |d4=0.570 µm²
+   |a4=CPP            |d4=220 nm     |a42=MMP             |d42=210 nm
 }}
 {{intel proc tech |year=2007 |name=P1266 |mlayers=9 |node=45 nm
    |archs=Penryn, Nehalem
-   |a1=L<sub>g</sub>  |d1=25 nm
+   |a1=T<sub>ox</sub> |d1=           |a12=Gate Dielectric |d12=High-κ
-   |a2=T<sub>ox</sub> |d2=? nm |a22=Gate Dielectric |d22=High-κ
+   |a2=V<sub>dd</sub> |d2=           |a22=SRAM            |d22=0.346 µm²
-   |a3=V<sub>dd</sub> |d3=? V
+   |a3=L<sub>g</sub>  |d3=25 nm
-   |a4=SRAM (HD)      |d4=0.346 µm²
+   |a4=CPP            |d4=160 nm     |a42=MMP             |d42=180 nm
 }}
 {{intel proc tech |year=2009 |name=P1268 |mlayers=10 |node=32 nm
    |archs=Westmere, Sandy Bridge
    |a1=T<sub>ox</sub> |d1=           |a12=Gate Dielectric |d12=High-κ
-   |a2=V<sub>dd</sub> |d2=           |a22=SRAM            |d22=0.092 µm²
+   |a2=V<sub>dd</sub> |d2=           |a22=SRAM            |d22=0.148 µm²
    |a3=L<sub>g</sub>  |d3=30 nm
    |a4=CPP            |d4=112.5 nm   |a42=MMP             |d42=112.5 nm

WikiChip

The Fuse Coverage

Social Media

Companies

Microarchitectures

Technology Nodes

Intel

AMD

ARM

Cavium

Samsung

Intel

AMD

Ampere

Apple

Cavium

HiSilicon

MediaTek

NXP

Qualcomm

Renesas

Samsung

Revision as of 05:46, 11 May 2017

Timeline