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[[File:cascade lake ap board.JPG|right|thumb|Cascade Lake AP board]]
 
[[File:cascade lake ap board.JPG|right|thumb|Cascade Lake AP board]]
 
{{main|intel/cores/cascade_lake_ap|l1=Cascade Lake Advanced Performance}}
 
{{main|intel/cores/cascade_lake_ap|l1=Cascade Lake Advanced Performance}}
Intel introduced a number of new products, code name {{intel|Cascade Lake Advanced Performance|l=core}}, which doubled the core count. Intel achieved this by packaging two extreme core count (XCC) dies together on the same substrate in a BGA package. The two dies are interconnected through 1 {{intel|UPI}} link which paved the way for models up to 56 cores. This was done to support a fully-connected system in a 2-way SMP system which is where those chips are designed to go. In those systems, every die is interconnected to every other die (four in total) over a {{intel|UPI}} link. With two dies per package, each CPU exposes 12 DDR4 memory channels and x40 PCIe Gen3 lanes.
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Intel introduced a number of new products, code name {{intel|Cascade Lake Advanced Performance|l=core}}, which doubled the core count. Intel achieved this by packaging two extreme core count (XCC) dies together on the same substrate in a BGA package. The two dies are interconnected through 1 {{intel|UPI}} link which paved the way for models up to 56 cores. This was done to support a fully-connected system in a 2-way SMP system which is where those chips are designed to go. In those systems, every die is interconnected to every other die (four in total) over a {{intel|UPI}} link. With to dies per package, each CPU exposes 12 DDR4 memory channels and x40 PCIe Gen3 lanes.
  
  

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codenameCascade Lake +
core count2 +, 4 +, 6 +, 8 +, 10 +, 12 +, 16 +, 18 +, 20 +, 22 +, 24 +, 26 +, 28 +, 32 +, 48 + and 56 +
designerIntel +
first launched2019 +
full page nameintel/microarchitectures/cascade lake +
instance ofmicroarchitecture +
instruction set architecturex86-64 +
manufacturerIntel +
microarchitecture typeCPU +
nameCascade Lake +
pipeline stages (max)19 +
pipeline stages (min)14 +
process14 nm (0.014 μm, 1.4e-5 mm) +