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Intel actual large effort research into the area of [[many-core]] started after the February 2004 [[Intel Developer Forum]] following Pradeep Dubey famous keynote titled "The Era of Tera." Around the [[2004]]-[[2005]] Intel formed a number of strategic research projects to explorer and study the feasibility and challenges of many-core and tera-scale processing. One of the earliest examples of such project was the {{intel|Tera-scale Computing Research Program}} which was unveiled by Justin Rattner, then-CTO, at the spring 2006 Intel Develop Forum.
 
Intel actual large effort research into the area of [[many-core]] started after the February 2004 [[Intel Developer Forum]] following Pradeep Dubey famous keynote titled "The Era of Tera." Around the [[2004]]-[[2005]] Intel formed a number of strategic research projects to explorer and study the feasibility and challenges of many-core and tera-scale processing. One of the earliest examples of such project was the {{intel|Tera-scale Computing Research Program}} which was unveiled by Justin Rattner, then-CTO, at the spring 2006 Intel Develop Forum.
  
The first product to come directly from that project was {{intel|Polaris|l=arch}}, an 80-core chip designed using modular tiles that could scale in the x- and y- directions using a routing system that interconnected all the tiles in a [[mesh topology]]. Fabricated on a [[65 nm process]], the chip was around 275 mm² and incorporated around 100M transistors. The chip also attempted to solve some of the inherent problems dealing with a large amount of cores such as the bandwidth. [[3D IC|3D]] [[stacked]] SRAM was utilized to achieve bandwidths of over 1 Tb/s. Operating as high as 5.7 GHz, the chip could reach over 1.8 [[teraFLOPS]] of sustained performance.
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The first product to come directly from that project was {{intel|Polaris|l=arch}}, an 80-core chip designed using modular tiles that could scale in the x- and y- directions using a routing system that interconnected all the tiles in a [[mesh topology]]. Fabricated on a [[65 nm process]], the chip was around 275 mm² and incorporated around 100M transistors. The chip also attempted to solve some of the inherit problems dealing with a large amount of cores such as the bandwidth. [[3D IC|3D]] [[stacked]] SRAM was utilized to achieve bandwidths of over 1 Tb/s. Operating as high as 5.7 GHz, the chip could reach over 1.8 [[teraFLOPS]] of sustained performance.
  
 
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