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Difference between revisions of "intel/core i7/i7-8750h"
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{{chip
 
{{chip
 
|name=Core i7-8750H
 
|name=Core i7-8750H
|no image=Yes
+
|image=coffee lake h (front).png
 +
|caption=Coffee Lake H, Front
 
|designer=Intel
 
|designer=Intel
 
|manufacturer=Intel
 
|manufacturer=Intel
 
|model number=i7-8750H
 
|model number=i7-8750H
 +
|part number=CL8068403359524
 +
|s-spec=SR3YY
 
|market=Mobile
 
|market=Mobile
 
|first announced=April 2, 2018
 
|first announced=April 2, 2018
 
|first launched=April 2, 2018
 
|first launched=April 2, 2018
 +
|release price=$395
 
|family=Core i7
 
|family=Core i7
 
|series=i7-8000
 
|series=i7-8000
 
|locked=Yes
 
|locked=Yes
 
|frequency=2,200 MHz
 
|frequency=2,200 MHz
|turbo frequency1=4,200 MHz
+
|turbo frequency1=4,100 MHz
 +
|turbo frequency2=4,100 MHz
 +
|turbo frequency4=4,000 MHz
 
|turbo frequency6=3,900 MHz
 
|turbo frequency6=3,900 MHz
 
|bus type=DMI 3.0
 
|bus type=DMI 3.0
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|isa family=x86
 
|isa family=x86
 
|microarch=Coffee Lake
 
|microarch=Coffee Lake
 +
|platform=Coffee Lake
 +
|chipset=300 series
 
|core name=Coffee Lake H
 
|core name=Coffee Lake H
 +
|core family=6
 +
|core model=158
 +
|core stepping=U0
 
|process=14 nm
 
|process=14 nm
 
|technology=CMOS
 
|technology=CMOS
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|max memory=64 GiB
 
|max memory=64 GiB
 
|tdp=45 W
 
|tdp=45 W
 +
|ctdp down=35 W
 +
|tjunc min=0 °C
 +
|tjunc max=100 °C
 
|package module 1={{packages/intel/fcbga-1440}}
 
|package module 1={{packages/intel/fcbga-1440}}
 
}}
 
}}
'''Core i7-8750H''' is a {{arch|64}} [[hexa-core]] high-end performance [[x86]] mobile microprocessor set to be introduced by [[Intel]] in [[2018]]. This processor, which is based on the {{intel|Coffee Lake|l=arch}} microarchitecture, is manufactured on Intel's 3rd generation enhanced [[14 nm process|14nm++ process]]. The i7-8750H operates at 2.2 GHz with a TDP of 45 W and a {{intel|turbo boost}} of up to 4.1 GHz, integrating Intel's {{intel|UHD Graphics 630}} GPU.
+
'''Core i7-8750H''' is a {{arch|64}} [[hexa-core]] high-end performance [[x86]] mobile microprocessor introduced by [[Intel]] in early [[2018]]. This processor, which is based on the {{intel|Coffee Lake|l=arch}} microarchitecture, is manufactured on Intel's 3rd generation enhanced [[14 nm process|14nm++ process]]. The i7-8750H operates at 2.2 GHz with a TDP of 45 W and a {{intel|turbo boost}} of up to 4.1 GHz. This chip integrates Intel's {{intel|UHD Graphics 630}} GPU operating at 350 MHz with a burst frequency of up to 1.1 GHz and supports up to 64 GiB of dual-channel DDR4-2666 memory.
 
 
 
 
{{unknown features}}
 
 
 
 
 
  
 +
This model has a configurable TDP-down of 35 W.
  
 
== Cache ==
 
== Cache ==
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{{memory controller
 
{{memory controller
 
|type=DDR4-2666
 
|type=DDR4-2666
 +
|type 2=LPDDR3-2133
 
|ecc=No
 
|ecc=No
 
|max mem=64 GiB
 
|max mem=64 GiB
 
|controllers=1
 
|controllers=1
 
|channels=2
 
|channels=2
 +
|width=64 bit
 
|max bandwidth=39.74 GiB/s
 
|max bandwidth=39.74 GiB/s
 
|bandwidth schan=19.87 GiB/s
 
|bandwidth schan=19.87 GiB/s
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}}
 
}}
 
}}
 
}}
 +
 
== Graphics ==
 
== Graphics ==
 
{{integrated graphics
 
{{integrated graphics
 
| gpu                = UHD Graphics 630
 
| gpu                = UHD Graphics 630
| device id          =  
+
| device id          = 0x3E9B
 
| designer            = Intel
 
| designer            = Intel
 
| execution units    = 24
 
| execution units    = 24
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| directx ver        = 12
 
| directx ver        = 12
| opengl ver        = 4.4
+
| opengl ver        = 4.5
 
| opencl ver        = 2.0
 
| opencl ver        = 2.0
 
| hdmi ver          = 1.4a
 
| hdmi ver          = 1.4a
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| intel intru 3d      = Yes
 
| intel intru 3d      = Yes
 
| intel insider        =  
 
| intel insider        =  
| intel widi          = Yes
+
| intel widi          =  
 
| intel fdi            =  
 
| intel fdi            =  
 
| intel clear video    = Yes
 
| intel clear video    = Yes
Line 184: Line 197:
 
|bpt=No
 
|bpt=No
 
|eist=Yes
 
|eist=Yes
|sst=No
+
|sst=Yes
|flex=No
+
|flex=Yes
 
|fastmem=No
 
|fastmem=No
 
|ivmd=No
 
|ivmd=No
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|sba=No
 
|sba=No
 
|mwt=No
 
|mwt=No
|sipp=Yes
+
|sipp=No
 
|att=No
 
|att=No
 
|ipt=Yes
 
|ipt=Yes
 
|tsx=No
 
|tsx=No
|txt=Yes
+
|txt=No
 
|ht=Yes
 
|ht=Yes
|vpro=Yes
+
|vpro=No
 
|vtx=Yes
 
|vtx=Yes
 
|vtd=Yes
 
|vtd=Yes
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|sensemi=No
 
|sensemi=No
 
|xfr=No
 
|xfr=No
 +
|xfr2=No
 +
|mxfr=No
 +
|amdpb=No
 +
|amdpb2=No
 +
|amdpbod=No
 
}}
 
}}

Revision as of 20:56, 15 July 2018

Edit Values
Core i7-8750H
coffee lake h (front).png
Coffee Lake H, Front
General Info
DesignerIntel
ManufacturerIntel
Model Numberi7-8750H
Part NumberCL8068403359524
S-SpecSR3YY
MarketMobile
IntroductionApril 2, 2018 (announced)
April 2, 2018 (launched)
Release Price$395
ShopAmazon
General Specs
FamilyCore i7
Seriesi7-8000
LockedYes
Frequency2,200 MHz
Turbo Frequency4,100 MHz (1 core),
4,100 MHz (2 cores),
4,000 MHz (4 cores),
3,900 MHz (6 cores)
Bus typeDMI 3.0
Bus rate4 × 8 GT/s
Clock multiplier22
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureCoffee Lake
PlatformCoffee Lake
Chipset300 series
Core NameCoffee Lake H
Core Family6
Core Model158
Core SteppingU0
Process14 nm
TechnologyCMOS
Die149 mm²
Word Size64 bit
Cores6
Threads12
Max Memory64 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP45 W
cTDP down35 W
Tjunction0 °C – 100 °C
Packaging
PackageFCBGA-1440 (BGA)
Dimension42 mm x 28 mm x 1.49 mm
Pitch0.65 mm
Ball Count1440
Ball CompSAC405
InterconnectBGA-1440

Core i7-8750H is a 64-bit hexa-core high-end performance x86 mobile microprocessor introduced by Intel in early 2018. This processor, which is based on the Coffee Lake microarchitecture, is manufactured on Intel's 3rd generation enhanced 14nm++ process. The i7-8750H operates at 2.2 GHz with a TDP of 45 W and a turbo boost of up to 4.1 GHz. This chip integrates Intel's UHD Graphics 630 GPU operating at 350 MHz with a burst frequency of up to 1.1 GHz and supports up to 64 GiB of dual-channel DDR4-2666 memory.

This model has a configurable TDP-down of 35 W.

Cache

Main article: Coffee Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$386 KiB
395,264 B
0.377 MiB
L1I$192 KiB
196,608 B
0.188 MiB
6x32 KiB8-way set associative 
L1D$192 KiB
196,608 B
0.188 MiB
6x32 KiB8-way set associativewrite-back

L2$1.5 MiB
1,536 KiB
1,572,864 B
0.00146 GiB
  6x256 KiB4-way set associativewrite-back

L3$9 MiB
9,216 KiB
9,437,184 B
0.00879 GiB
  6x1.5 MiB12-way set associativewrite-back

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2666, LPDDR3-2133
Supports ECCNo
Max Mem64 GiB
Controllers1
Channels2
Width64 bit
Max Bandwidth39.74 GiB/s
40,693.76 MiB/s
42.671 GB/s
42,670.5 MB/s
0.0388 TiB/s
0.0427 TB/s
Bandwidth
Single 19.87 GiB/s
Double 39.74 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 3.0
Max Lanes: 16
Configuration: 1x16, 2x8, 1x8+2x4


Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUUHD Graphics 630
DesignerIntelDevice ID0x3E9B
Execution Units24Max Displays3
Max Memory64 GiB
65,536 MiB
67,108,864 KiB
68,719,476,736 B
Frequency350 MHz
0.35 GHz
350,000 KHz
Burst Frequency1,100 MHz
1.1 GHz
1,100,000 KHz
OutputDP, eDP, HDMI, DVI

Max Resolution
HDMI4096x2304 @24 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz

Standards
DirectX12
OpenGL4.5
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a

Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD

Features

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
TBT 2.0Turbo Boost Technology 2.0
EISTEnhanced SpeedStep Technology
SSTSpeed Shift Technology
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
Flex MemoryFlex Memory Access
IPTIdentity Protection Technology
Facts about "Core i7-8750H - Intel"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Core i7-8750H - Intel#package + and Core i7-8750H - Intel#pcie +
base frequency2,200 MHz (2.2 GHz, 2,200,000 kHz) +
bus links4 +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipset300 series +
clock multiplier22 +
core count6 +
core family6 +
core model158 +
core nameCoffee Lake H +
core steppingU0 +
designerIntel +
device id0x3E9B +
die area149 mm² (0.231 in², 1.49 cm², 149,000,000 µm²) +
familyCore i7 +
first announcedApril 2, 2018 +
first launchedApril 2, 2018 +
full page nameintel/core i7/i7-8750h +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel identity protection technology supporttrue +
has intel secure key technologytrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel turbo boost technology 2 0true +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuUHD Graphics 630 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency1,100 MHz (1.1 GHz, 1,100,000 KHz) +
integrated gpu max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB) +
isax86-64 +
isa familyx86 +
l1$ size386 KiB (395,264 B, 0.377 MiB) +
l1d$ description8-way set associative +
l1d$ size192 KiB (196,608 B, 0.188 MiB) +
l1i$ description8-way set associative +
l1i$ size192 KiB (196,608 B, 0.188 MiB) +
l2$ description4-way set associative +
l2$ size1.5 MiB (1,536 KiB, 1,572,864 B, 0.00146 GiB) +
l3$ description12-way set associative +
l3$ size9 MiB (9,216 KiB, 9,437,184 B, 0.00879 GiB) +
ldateApril 2, 2018 +
main imageFile:coffee lake h (front).png +
main image captionCoffee Lake H, Front +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth39.74 GiB/s (40,693.76 MiB/s, 42.671 GB/s, 42,670.5 MB/s, 0.0388 TiB/s, 0.0427 TB/s) +
max memory channels2 +
microarchitectureCoffee Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model numberi7-8750H +
nameCore i7-8750H +
packageFCBGA-1440 +
part numberCL8068403359524 +
platformCoffee Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 395.00 (€ 355.50, £ 319.95, ¥ 40,815.35) +
s-specSR3YY +
seriesi7-8000 +
smp max ways1 +
supported memory typeDDR4-2666 + and LPDDR3-2133 +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
tdp down35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count12 +
turbo frequency (1 core)4,100 MHz (4.1 GHz, 4,100,000 kHz) +
turbo frequency (2 cores)4,100 MHz (4.1 GHz, 4,100,000 kHz) +
turbo frequency (4 cores)4,000 MHz (4 GHz, 4,000,000 kHz) +
turbo frequency (6 cores)3,900 MHz (3.9 GHz, 3,900,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +