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'''Atom Z650''' is an ultra-low power {{arch|32}} [[x86]] system on a chip designed by [[Intel]] and introduced in mid-[[2011]]. The Z650, which is based on the {{intel|Bonnell|l=arch}} microarchitecture ({{intel|Lincroft|l=core}} core), is fabricated on a [[45 nm process]]. This SoC incorporates a single core operating at 1.2 GHz with a low frequency mode of 600 MHz. The chip has a TDP of 3 W and supporting up to a 2 GiB of single-channel DDR2-800 memory. Additionally, the Z650 incorporates a {{imgtec|PowerVR SGX 535|GMA 600}} [[IGP]] operating at 400 MHz.
 
'''Atom Z650''' is an ultra-low power {{arch|32}} [[x86]] system on a chip designed by [[Intel]] and introduced in mid-[[2011]]. The Z650, which is based on the {{intel|Bonnell|l=arch}} microarchitecture ({{intel|Lincroft|l=core}} core), is fabricated on a [[45 nm process]]. This SoC incorporates a single core operating at 1.2 GHz with a low frequency mode of 600 MHz. The chip has a TDP of 3 W and supporting up to a 2 GiB of single-channel DDR2-800 memory. Additionally, the Z650 incorporates a {{imgtec|PowerVR SGX 535|GMA 600}} [[IGP]] operating at 400 MHz.
 
This chip communicates with the [[southbridge]] chipset (PCH MP30) over two buses: cDMI and cDVO. Both buses go from the SoC to the chipset. cDMI, which is used as the data interface link, operates at 100 MHz using a quad-pumped rate (i.e. 400 MT/s). That bus is composed of an 8-bit transmit and 8-bit receive. The cDVO, which is used as a unidirectional display data link is a quad-pumped 6-bit bus operating 200 MHz for a 800 MT/s effective rate. This model uses a [[GTL|AGTL+]] signaling bus for this.
 
  
 
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Facts about "Atom Z650 - Intel"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Atom Z650 - Intel#package +
base frequency1,200 MHz (1.2 GHz, 1,200,000 kHz) +
bus rate400 MT/s (0.4 GT/s, 400,000 kT/s) +
bus speed100 MHz (0.1 GHz, 100,000 kHz) +
bus typecDMI +
chipsetLangwell +
clock multiplier8 +
core count1 +
core family6 +
core model38 +
core nameLincroft +
core stepping1 +
core voltage (max)1.15 V (11.5 dV, 115 cV, 1,150 mV) +
core voltage (min)0.7 V (7 dV, 70 cV, 700 mV) +
cpuid20661 +
designerIntel +
familyAtom +
first announcedApril 11, 2011 +
first launchedApril 11, 2011 +
full page nameintel/atom/z650 +
has ecc memory supportfalse +
has featureHyper-Threading Technology + and Enhanced SpeedStep Technology +
has intel enhanced speedstep technologytrue +
has locked clock multipliertrue +
has simultaneous multithreadingtrue +
instance ofmicroprocessor +
integrated gpuPowerVR SGX535 +
integrated gpu base frequency400 MHz (0.4 GHz, 400,000 KHz) +
integrated gpu designerImagination Technologies +
integrated gpu max memory256 MiB (262,144 KiB, 268,435,456 B, 0.25 GiB) +
isax86-32 +
isa familyx86 +
l1$ size56 KiB (57,344 B, 0.0547 MiB) +
l1d$ description6-way set associative +
l1d$ size24 KiB (24,576 B, 0.0234 MiB) +
l1i$ description8-way set associative +
l1i$ size32 KiB (32,768 B, 0.0313 MiB) +
l2$ description8-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
last orderFebruary 5, 2013 +
last shipmentMay 7, 2013 +
ldateApril 11, 2011 +
main imageFile:lincroft chips.png +
manufacturerIntel +
market segmentMobile +
max case temperature343.15 K (70 °C, 158 °F, 617.67 °R) +
max cpu count1 +
max junction temperature363.15 K (90 °C, 194 °F, 653.67 °R) +
max memory2,048 MiB (2,097,152 KiB, 2,147,483,648 B, 2 GiB, 0.00195 TiB) +
max memory bandwidth2.98 GiB/s (3,051.52 MiB/s, 3.2 GB/s, 3,199.751 MB/s, 0.00291 TiB/s, 0.0032 TB/s) +
max memory channels1 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureBonnell +
min case temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature218.15 K (-55 °C, -67 °F, 392.67 °R) +
model numberZ650 +
nameAtom Z650 +
packageFCBGA-518 +
part numberAY80609007296AA +
platformOak Trail +
process45 nm (0.045 μm, 4.5e-5 mm) +
s-specSLC2Q +
seriesZ650 +
smp max ways1 +
socketBGA-518 +
supported memory typeDDR-400 + and DDR2-800 +
tdp3 W (3,000 mW, 0.00402 hp, 0.003 kW) +
technologyCMOS +
thread count2 +
word size32 bit (4 octets, 8 nibbles) +