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Atom Z605 - Intel
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Atom Z605
lincroft chips.png
General Info
DesignerIntel
ManufacturerIntel
Model NumberZ605
Part NumberAY80609005805AA
S-SpecSLC3C
MarketMobile
IntroductionMay 4, 2010 (announced)
May 4, 2010 (launched)
ShopAmazon
General Specs
FamilyAtom
SeriesZ605
LockedYes
Frequency1,000 MHz
Bus typecDMI
Bus speed100 MHz
Bus rate400 MT/s
Clock multiplier10
CPUID20661
Microarchitecture
ISAx86-32 (x86)
MicroarchitectureBonnell
PlatformMoorestown
ChipsetLangwell
Core NameLincroft
Core Family6
Core Model38
Core Stepping1
Process45 nm
Transistors140,000,000
TechnologyCMOS
Die65.2526 mm²
8.89 mm × 7.34 mm
Word Size32 bit
Cores1
Threads2
Max Memory2 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore0.75 V-1.2 V
TDP2.2 W
Tjunction0 °C – 90 °C
Tstorage-55 °C – 125 °C
Packaging
PackageFCBGA-518 (FCBGA)
Dimension13.8 mm x 13.8 mm x 1.1 mm
Pin Count518
SocketBGA-518 (BGA)

Atom Z605 is an ultra-low power 32-bit x86 system on a chip designed by Intel and introduced in early 2010. The Z605, which is based on the Bonnell microarchitecture (Lincroft core), is fabricated on a 45 nm process. This SoC incorporates a single core operating at 1 GHz with a low frequency mode of 600 MHz. The chip has a TDP of 2.2 W and supporting up to a 2 GiB of single-channel DDR2-800 memory. Additionally, the Z605 incorporates a GMA 600 IGP operating at 400 MHz.

This chip communicates with the southbridge chipset (PCH MP30) over two buses: cDMI and cDVO. Both buses go from the SoC to the chipset. cDMI, which is used as the data interface link, operates at 100 MHz using a quad-pumped rate (i.e. 400 MT/s). That bus is composed of an 8-bit transmit and 8-bit receive. The cDVO, which is used as a unidirectional display data link is a quad-pumped 6-bit bus operating 200 MHz for a 800 MT/s effective rate. This model uses a AGTL+ signaling bus for this.

Cache

Main article: Bonnell § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$56 KiB
57,344 B
0.0547 MiB
L1I$32 KiB
32,768 B
0.0313 MiB
1x32 KiB8-way set associative 
L1D$24 KiB
24,576 B
0.0234 MiB
1x24 KiB6-way set associativewrite-back

L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  1x512 KiB8-way set associative 

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR-400, DDR2-800
Supports ECCNo
Max Mem2 GiB
Controllers1
Channels1
Width32 bit
Max Bandwidth2.98 GiB/s
3,051.52 MiB/s
3.2 GB/s
3,199.751 MB/s
0.00291 TiB/s
0.0032 TB/s
Bandwidth
Single 2.98 GiB/s
Physical Address (PAE)32 bit

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0
Ports4
UART

GP I/OYes


Graphics

This chip incroporates the "GMA 600" integrated graphics which is actually a re-branded licensed Imagination PowerVR SGX 535 IGP.

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR SGX535
DesignerImagination Technologies
Max Displays1
Max Memory256 MiB
262,144 KiB
268,435,456 B
0.25 GiB
Frequency400 MHz
0.4 GHz
400,000 KHz
OutputDSI, LVDS

Max Resolution
DSI1024x600
LVDS1366x768

Standards
Direct3D9.0c
OpenGL2.1
OpenGL ES1.1, 2.0
OpenVG1.1

Additional Features
Intel Clear Video
  • Supports hardware-accelerated HD video decode (MPEG4 part 2, H.264, WMV, and VC1)
  • Supports hardware-accelerated HD video encode (MPEG4 part 2 and H.264)

Features

Die Shot

See also: Bonnell § Lincroft Die
  • 45 nm process
  • 140,000,000
  • Die size 7.34 mm × 8.89 mm
  • Size area 65.2526 mm²

lincroft die shot.png

lincroft die shot (annotated).png


lincroft die shot 2.png

lincroft die shot 2 (annotated).png

Documents

Datasheet

Facts about "Atom Z605 - Intel"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Atom Z605 - Intel#package +
base frequency1,000 MHz (1 GHz, 1,000,000 kHz) +
bus rate400 MT/s (0.4 GT/s, 400,000 kT/s) +
bus speed100 MHz (0.1 GHz, 100,000 kHz) +
bus typecDMI +
chipsetLangwell +
clock multiplier10 +
core count1 +
core family6 +
core model38 +
core nameLincroft +
core stepping1 +
core voltage (max)1.2 V (12 dV, 120 cV, 1,200 mV) +
core voltage (min)0.75 V (7.5 dV, 75 cV, 750 mV) +
cpuid20661 +
designerIntel +
die area65.253 mm² (0.101 in², 0.653 cm², 65,252,600 µm²) +
die length8.89 mm (0.889 cm, 0.35 in, 8,890 µm) +
die width7.34 mm (0.734 cm, 0.289 in, 7,340 µm) +
familyAtom +
first announcedMay 4, 2010 +
first launchedMay 4, 2010 +
full page nameintel/atom/z605 +
has ecc memory supportfalse +
has featureHyper-Threading Technology +, Burst Performance Technology + and Enhanced SpeedStep Technology +
has intel burst performance technologytrue +
has intel enhanced speedstep technologytrue +
has locked clock multipliertrue +
has simultaneous multithreadingtrue +
instance ofmicroprocessor +
integrated gpuPowerVR SGX535 +
integrated gpu base frequency400 MHz (0.4 GHz, 400,000 KHz) +
integrated gpu designerImagination Technologies +
integrated gpu max memory256 MiB (262,144 KiB, 268,435,456 B, 0.25 GiB) +
isax86-32 +
isa familyx86 +
l1$ size56 KiB (57,344 B, 0.0547 MiB) +
l1d$ description6-way set associative +
l1d$ size24 KiB (24,576 B, 0.0234 MiB) +
l1i$ description8-way set associative +
l1i$ size32 KiB (32,768 B, 0.0313 MiB) +
l2$ description8-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
ldateMay 4, 2010 +
main imageFile:lincroft chips.png +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature363.15 K (90 °C, 194 °F, 653.67 °R) +
max memory2,048 MiB (2,097,152 KiB, 2,147,483,648 B, 2 GiB, 0.00195 TiB) +
max memory bandwidth2.98 GiB/s (3,051.52 MiB/s, 3.2 GB/s, 3,199.751 MB/s, 0.00291 TiB/s, 0.0032 TB/s) +
max memory channels1 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureBonnell +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature218.15 K (-55 °C, -67 °F, 392.67 °R) +
model numberZ605 +
nameAtom Z605 +
packageFCBGA-518 +
part numberAY80609005805AA +
platformMoorestown +
process45 nm (0.045 μm, 4.5e-5 mm) +
s-specSLC3C +
seriesZ605 +
smp max ways1 +
socketBGA-518 +
supported memory typeDDR-400 + and DDR2-800 +
tdp2.2 W (2,200 mW, 0.00295 hp, 0.0022 kW) +
technologyCMOS +
thread count2 +
transistor count140,000,000 +
word size32 bit (4 octets, 8 nibbles) +