From WikiChip
Difference between revisions of "intel/microarchitectures/cannon lake"
< intel‎ | microarchitectures

(Process Technology)
(All Cannon Lake Chips)
Line 138: Line 138:
<tr><th>&nbsp;</th><th colspan="23"><span style="font-size: 20px;">No Cannon Lake Chips have been released yet.</span></th></tr>
{{comp table count|ask=[[Category:microprocessor models by intel]][[instance of::microprocessor]][[microarchitecture::Cannon Lake]]}}
{{comp table count|ask=[[Category:microprocessor models by intel]][[instance of::microprocessor]][[microarchitecture::Cannon Lake]]}}

Revision as of 12:33, 28 January 2018

Edit Values
Cannon Lake µarch
General Info
Arch TypeCPU
Process10 nm
Core NamesCannon Lake Y,
Cannon Lake U

Cannon Lake (CNL) (formerly Skymont) is a planned microarchitecture by Intel as a successor to Kaby Lake. Cannon Lake is expected to be fabricated using a 10 nm process and is set to be introduced in the fourth quarter of 2017. Cannon Lake is the "Process" microarchitecture as part of Intel's PAO model.

For mobile, Cannon Lake is expected to be branded as 8th Generation Intel Core i3, Core i5. and Core i7 processors.

Process Technology

Cannon Lake is manufactured on Intel's 10 nm process (P1274). Intel's 10 nm process is the first high-volume manufacturing process to employ Self-Aligned Quad Patterning (SAQP) (goes under the "Hyper-Scaling" marketing name). Intel's 10nm features a 0.0367 µm² SRAM bit cell.


Broadwell Cannon Lake Δ intel 10nm fin.png
14 nm 10 nm
Fin Pitch 42 nm 34 0.81x
Fin Width​ 8 nm 7 nm 0.88x
Fin Height​ 42 nm 53 nm 1.24x
Gate Pitch 70 nm 54 nm 0.77x
Interconnect Pitch 52 nm 36 nm 0.69x
Cell Height 399 nm 272 nm 0.68x


Symbol version future.svg Preliminary Data! Information presented in this article deal with future products, data, features, and specifications that have yet to be finalized, announced, or released. Information may be incomplete and can change by final release.
Core Abbrev Description Graphics Target
Cannon Lake Y CNL-Y Extremely low power GT2 2-in-1s detachable, tablets, and computer sticks
Cannon Lake U CNL-U Ultra-low Power GT2/GT3 Light notebooks, portable All-in-Ones (AiOs), Minis, and conference room
Cannon Lake H CNL-H High-performance Graphics GT2/GT3 Ultimate mobile performance, mobile workstations
Cannon Lake S CNL-S Performance-optimized lifestyle GT2/GT3 Desktop performance to value, AiOs, and minis
Cannon Lake DT CNL-DT Workstation GT2 Workstations & entry-level servers


New text document.svg This section is empty; you can help add the missing info by editing this page.

Key changes from Kaby Lake

  • 10 nm process (from 14 nm)
  • Mainstream chipset
    • 200 Series chipset → 300 Series chipset
      • Integrated Programmable (Open FW SDK) Quad-Core Audio DSP
      • Soundwire Digital Audio Interface
      • Integrated USB 3.1 (10 Gib/s)
        • Up to 6 ports
      • Integrated Intel wireless controller (IEEE 802.11ac)
      • Integrated SDXC 3.0 controller
      • Thunderbolt 3.0(Titan Ridge) with DisplayPort 1.4 support
      • C10 & S0ix Support for Modern Standby

All Cannon Lake Chips

 Cannon Lake Chips
 Main processorIGPMajor Feature Diff
ModelLaunchedPriceFamilyPlatformCoreCTL3$L4$TDPFreqTurboMax MemNameFreqTurboTBTHTAVX2TXTTSXvProVT-d
M3-8114YCore M3Cannon Lake Y241.5 GHz
1,500 MHz
1,500,000 kHz
16 GiB
16,384 MiB
16,777,216 KiB
17,179,869,184 B
0.0156 TiB
UHD Graphics ?300 MHz
0.3 GHz
300,000 KHz
i3-8121U15 May 2018Core i3Cannon Lake U244 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
15 W
15,000 mW
0.0201 hp
0.015 kW
2.2 GHz
2,200 MHz
2,200,000 kHz
3.2 GHz
3,200 MHz
3,200,000 kHz
32 GiB
32,768 MiB
33,554,432 KiB
34,359,738,368 B
0.0313 TiB
Count: 2


  • Mark Bohr, Intel. Intel Technology and Manufacturing Day. Mar 28, 2017.

See also

codenameCannon Lake +
designerIntel +
first launched2017 +
full page nameintel/microarchitectures/cannon lake +
instance ofmicroarchitecture +
instruction set architecturex86-64 +
manufacturerIntel +
microarchitecture typeCPU +
nameCannon Lake +
process10 nm (0.01 μm, 1.0e-5 mm) +