From WikiChip
POWER9 02CY228 - IBM
< ibm

Edit Values
02CY228
General Info
DesignerIBM
ManufacturerGlobalFoundries
Model Number02CY228
Part Number02CY228
MarketServer, Workstation
IntroductionNovember, 2017 (announced)
November, 2017 (launched)
General Specs
FamilyPOWER
SeriesPOWER9
Frequency2.70 GHz
Turbo Frequency3.80 GHz
Microarchitecture
ISAPower ISA v3.0B (Power ISA)
MicroarchitecturePOWER9
Core NameSforza
Process14 nm
Transistors8,000,000,000
TechnologyCMOS
Die693.37 mm²
25.228 mm × 27.48416 mm
Word Size64 bit
Cores20
Threads80
Max CPUs2 (Multiprocessor)
Max Memory2 TiB
Electrical
TDP190 W
Tjunction0 °C – 85 °C
Packaging
PackageFCLGA-2601 (PLGA)
Dimension50 mm × 50 mm
Pitch1.016 mm
Contacts2601

POWER9 02CY228 is a 20-core POWER server and workstation microprocessor designed by IBM and introduced in late 2017. This chip is based on the POWER9 microarchitecture and is fabricated on GlobalFoundries 14nm SOI Process. The 02CY228 has a base frequency of 2.70 GHz with a bost frequency of 3.80 GHz and a TDP of 190 W.

Cache

Main article: POWER9 § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$1.25 MiB
1,280 KiB
1,310,720 B
0.00122 GiB
L1I$640 KiB
0.625 MiB
655,360 B
6.103516e-4 GiB
20x32 KiB8-way set associative 
L1D$640 KiB
0.625 MiB
655,360 B
6.103516e-4 GiB
20x32 KiB8-way set associative 

L2$5 MiB
5,120 KiB
5,242,880 B
0.00488 GiB
  10x512 KiB8-way set associative 

L3$100 MiB
102,400 KiB
104,857,600 B
0.0977 GiB
  10x10 MiB20-way set associative 

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2666
Supports ECCNo
Max Mem2 TiB
Controllers2
Channels8
Max Bandwidth158.95 GiB/s
276.573 GB/s
162,764.8 MiB/s
0.155 TiB/s
0.171 TB/s
Bandwidth
Single 19.87 GiB/s
Double 39.74 GiB/s
Quad 79.47 GiB/s
Octa 158.95 GiB/s
[Edit] Memory Configurations
Configuration Speed
One DIMM per channel 2666 MHz
Two DIMMs per channel 2400 MHz

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 4.0
Max Lanes: 48
Configuration: x16, x8, x4


Die

See also: POWER9 § Die

A die shot of IBM's 22-core server microprocessor used in this part:

power9 so die.png


power9 so die (annotated).png
Facts about "POWER9 02CY228 - IBM"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
POWER9 02CY228 - IBM#pcie +
base frequency2,700 MHz (2.7 GHz, 2,700,000 kHz) +
core count20 +
core nameSforza +
designerIBM +
die area693.37 mm² (1.075 in², 6.934 cm², 693,370,000 µm²) +
die length25.228 mm (2.523 cm, 0.993 in, 25,228 µm) +
die width27.484 mm (2.748 cm, 1.082 in, 27,484.16 µm) +
familyPOWER +
first announcedNovember 2017 +
first launchedNovember 2017 +
full page nameibm/power/02cy228 +
has ecc memory supportfalse +
instance ofmicroprocessor +
isaPower ISA v3.0B +
isa familyPower ISA +
l1$ size1.25 MiB (1,280 KiB, 1,310,720 B, 0.00122 GiB) +
l1d$ description8-way set associative +
l1d$ size0.625 MiB (640 KiB, 655,360 B, 6.103516e-4 GiB) +
l1i$ description8-way set associative +
l1i$ size0.625 MiB (640 KiB, 655,360 B, 6.103516e-4 GiB) +
l2$ description8-way set associative +
l2$ size5 MiB (5,120 KiB, 5,242,880 B, 0.00488 GiB) +
l3$ description20-way set associative +
l3$ size100 MiB (102,400 KiB, 104,857,600 B, 0.0977 GiB) +
ldateNovember 2017 +
manufacturerGlobalFoundries +
market segmentServer + and Workstation +
max cpu count2 +
max junction temperature358.15 K (85 °C, 185 °F, 644.67 °R) +
max memory2,097,152 MiB (2,147,483,648 KiB, 2,199,023,255,552 B, 2,048 GiB, 2 TiB) +
max memory bandwidth158.95 GiB/s (276.573 GB/s, 162,764.8 MiB/s, 0.155 TiB/s, 0.171 TB/s) +
max memory channels8 +
microarchitecturePOWER9 +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model number02CY228 +
name02CY228 +
packageFCLGA-2601 +
part number02CY228 +
process14 nm (0.014 μm, 1.4e-5 mm) +
seriesPOWER9 +
supported memory typeDDR4-2666 +
tdp190 W (190,000 mW, 0.255 hp, 0.19 kW) +
technologyCMOS +
thread count80 +
transistor count8,000,000,000 +
turbo frequency3,800 MHz (3.8 GHz, 3,800,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +