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|package name 1=ibm,fclga_2601
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'''POWER9 02CY089''' is an [[octa-core]] [[POWER]] server and workstation microprocessor designed by [[IBM]] and introduced in late [[2017]]. This chip is based on the {{ibm|POWER9|l=arch}} microarchitecture and is fabricated on GlobalFoundries [[14 nm process|14nm SOI Process]]. The 02CY089 has a base frequency of 3.5 GHz with a bost frequency of 3.80 GHz and a TDP of 160 W.
 
'''POWER9 02CY089''' is an [[octa-core]] [[POWER]] server and workstation microprocessor designed by [[IBM]] and introduced in late [[2017]]. This chip is based on the {{ibm|POWER9|l=arch}} microarchitecture and is fabricated on GlobalFoundries [[14 nm process|14nm SOI Process]]. The 02CY089 has a base frequency of 3.5 GHz with a bost frequency of 3.80 GHz and a TDP of 160 W.

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Facts about "POWER9 02CY089 - IBM"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
POWER9 02CY089 - IBM#pcie +
base frequency3,500 MHz (3.5 GHz, 3,500,000 kHz) +
core count8 +
core nameSforza +
designerIBM +
die area693.37 mm² (1.075 in², 6.934 cm², 693,370,000 µm²) +
die length25.228 mm (2.523 cm, 0.993 in, 25,228 µm) +
die width27.484 mm (2.748 cm, 1.082 in, 27,484.16 µm) +
familyPOWER +
first announcedNovember 2017 +
first launchedNovember 2017 +
full page nameibm/power/02cy089 +
has ecc memory supportfalse +
instance ofmicroprocessor +
isaPower ISA v3.0B +
isa familyPower ISA +
l1$ size512 KiB (524,288 B, 0.5 MiB) +
l1d$ description8-way set associative +
l1d$ size256 KiB (262,144 B, 0.25 MiB) +
l1i$ description8-way set associative +
l1i$ size256 KiB (262,144 B, 0.25 MiB) +
l2$ description8-way set associative +
l2$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
l3$ description20-way set associative +
l3$ size80 MiB (81,920 KiB, 83,886,080 B, 0.0781 GiB) +
ldateNovember 2017 +
manufacturerGlobalFoundries +
market segmentServer + and Workstation +
max cpu count2 +
max junction temperature358.15 K (85 °C, 185 °F, 644.67 °R) +
max memory2,097,152 MiB (2,147,483,648 KiB, 2,199,023,255,552 B, 2,048 GiB, 2 TiB) +
max memory bandwidth158.95 GiB/s (162,764.8 MiB/s, 170.671 GB/s, 170,671.263 MB/s, 0.155 TiB/s, 0.171 TB/s) +
max memory channels8 +
microarchitecturePOWER9 +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model number02CY089 +
name02CY089 +
packageFCLGA-2601 +
part number02CY089 +
process14 nm (0.014 μm, 1.4e-5 mm) +
seriesPOWER9 +
smp max ways2 +
supported memory typeDDR4-2666 +
tdp160 W (160,000 mW, 0.215 hp, 0.16 kW) +
technologyCMOS +
thread count32 +
transistor count8,000,000,000 +
turbo frequency3,800 MHz (3.8 GHz, 3,800,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +