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Kirin 810
General Info
Designer	HiSilicon, ARM Holdings
Manufacturer	TSMC
Model Number	810
Market	Mobile
Introduction	June 21, 2019 (announced) June 21, 2019 (launched)
General Specs
Family	Kirin
Series	800
Frequency	2,270 MHz, 1,880 MHz
Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A76, Cortex-A55
Core Name	Cortex-A76, Cortex-A55
Process	7 nm
Technology	CMOS
Word Size	64 bit
Cores	8
Threads	8
Multiprocessing
Max SMP	1-Way (Uniprocessor)
Succession
Kirin 710

Kirin 810 is a 64-bit octa-core mid-range performance mobile ARM SoC introduced by HiSilicon in mid-2019. This chip, which is fabricated on TSMC's 7 nm process, features two Cortex-A76 big cores operating at up to 2.27 GHz along with six Cortex-A55 little cores operating at up to 1.88 GHz. The 810 incorporates ARM's Mali-G52 MP6 GPU.

Cache

Main articles: Cortex-A55 § Cache and Cortex-A76 § Cache

For the Cortex-A76:

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 256 KiB 262,144 B 0.25 MiB L1I$ 128 KiB 131,072 B 0.125 MiB 2x64 KiB     L1D$ 128 KiB 131,072 B 0.125 MiB 2x64 KiB     L2$ 1 MiB 1,024 KiB 1,048,576 B 9.765625e-4 GiB     2x512 KiB

For the Cortex-A55:

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 384 KiB 393,216 B 0.375 MiB L1I$ 192 KiB 196,608 B 0.188 MiB 6x32 KiB     L1D$ 192 KiB 196,608 B 0.188 MiB 6x32 KiB     L2$ 768 KiB 0.75 MiB 786,432 B 7.324219e-4 GiB     6x128 KiB

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type LPDDR4X-4266 Supports ECC No Max Mem 8 GiB Controllers 1 Channels 4 Width 16 bit Max Bandwidth 31.78 GiB/s 32,542.72 MiB/s 34.124 GB/s 34,123.515 MB/s 0.031 TiB/s 0.0341 TB/s Bandwidth Double 15.89 GiB/s Quad 31.78 GiB/s

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU Mali-G52 Designer ARM Holdings Execution Units 6 Max Displays 2 Frequency 850 MHz 0.85 GHz 850,000 KHz Max Resolution   2340x1080 Standards DirectX 12 OpenCL 2.0 OpenGL ES 3.2 OpenVG 1.1 Vulkan 1.0

• Hardware Acceleration
  • Decode: 1080p @ 60fps
  • Encode: 1080p @ 30fps

NPU

This is the first neural processing unit to use their own homegrown NPU based on Hisilicon's first generation Da Vinci architecture. The NPU contains one processor core and a scheduling core.

ISP

• 40 MP+ 24 MP dual

48 single

Wireless

• LTE Modem
  • DL: Up to User Equipment (UE) category 21
    • Downlink of up to 1.4 Gbps (4x4 MIMO + 256QAM 3CC CA = 1.2 Gbps, 2x2 MIMI + 256QAM + 1CC = 200 Mbps)
  • UL: Up to User Equipment (UE) category 18
    • Uplink of up to 200 Mbps (2x2 MIMO, 256-QAM, 1x20MHz CA)
• Wi-Fi 802.11 ac
• Bluetooth 5
• NFC
• GPS / A-GPS / GLONASS / BDS

Location

• GPS, AGPS, Glonass, Beidou

Utilizing devices

• Huawei Nova 5
• Huawai 9X Pro, 9X
• Huawai Nova 7i

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