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Difference between revisions of "hisilicon/kirin"
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=== 900 Series ===

Revision as of 08:58, 21 June 2019

Kirin
hisilicon kirin logo.svg
Kirin Logo
Developer HiSilicon, ARM Holdings
Manufacturer TSMC
Type System on chips
Introduction 2013 (announced)
2014 (launch)
Architecture Performance mobile ARM SoCs
ISA ARM
µarch Cortex-A7, Cortex-A9, Cortex-A53, Cortex-A72, Cortex-A73
Word size 32 bit
4 octets
8 nibbles
, 64 bit
8 octets
16 nibbles
Process 28 nm
0.028 μm
2.8e-5 mm
, 16 nm
0.016 μm
1.6e-5 mm
, 10 nm
0.01 μm
1.0e-5 mm
, 7 nm
0.007 μm
7.0e-6 mm
Technology CMOS
Clock 1,200 MHz-2,300 MHz
Succession
K3

Kirin is a family of 32-bit and 64-bit mobile ARM performance SoCs introduced by HiSilicon in 2014 as a successor to the K3 series.

Overview

HiSilicon has always been the integrated circuit arm of Huawei, developing various ICs and embedded microprocessors for their consumer electronics. It wasn't until 2008 with the introduction of the K3 family that HiSilicon started focusing on developing in-house high-performance microprocessors for the mobile market. In late 2013 HiSilicon introduced the Kirin family which featured their flagship high-performance mobile microprocessors found in their high-end phones and tablets.

Over the last couple of years, the Kirin family grew to include various mid-range performance models in addition to their high-end performance flagship processors. Latest models often utilize ARM's latest cores fabricated on TSMC's latest technology node.

Members

600 Series

Kirin 620

Kirin 650

700 Series

Kirin 710

800 Series

Kirin 810

900 Series

Kirin 910
Kirin 920
Kirin 930
Kirin 950
Kirin 960
Kirin 970
Kirin 980

Facts about "Kirin - HiSilicon"
designerHiSilicon + and ARM Holdings +
first announced2013 +
first launched2014 +
full page namehisilicon/kirin +
instance ofsystem on a chip family +
instruction set architectureARM +
main designerHiSilicon +
manufacturerTSMC +
microarchitectureCortex-A7 +, Cortex-A9 +, Cortex-A53 +, Cortex-A72 + and Cortex-A73 +
nameKirin +
process28 nm (0.028 μm, 2.8e-5 mm) +, 16 nm (0.016 μm, 1.6e-5 mm) +, 10 nm (0.01 μm, 1.0e-5 mm) + and 7 nm (0.007 μm, 7.0e-6 mm) +
technologyCMOS +
word size32 bit (4 octets, 8 nibbles) + and 64 bit (8 octets, 16 nibbles) +