Revision history of "hisilicon/k3/k3v2"

Diff selection: Mark the radio boxes of the revisions to compare and hit enter or the button at the bottom.
Legend: (cur) = difference with latest revision, (prev) = difference with preceding revision, m = minor edit.

(cur | prev) 04:41, 21 July 2018‎ 196.166.227.177 (talk)‎ . . (3,419 bytes) (+40)‎ . . (undo)
(cur | prev) 01:37, 3 January 2018‎ 165.225.96.59 (talk)‎ . . (3,379 bytes) (+33)‎ . . (undo)
(cur | prev) 16:13, 13 December 2017‎ ChippyBot (talk | contribs)‎ m . . (3,346 bytes) (+1)‎ . . (Bot: moving all {{mpu}} to {{chip}}) (undo)
(cur | prev) 12:05, 6 September 2017‎ Inject (talk | contribs)‎ . . (3,345 bytes) (0)‎ . . (→‎Block Diagram) (undo)
(cur | prev) 12:04, 6 September 2017‎ Inject (talk | contribs)‎ . . (3,345 bytes) (+243)‎ . . (undo)
(cur | prev) 06:38, 6 September 2017‎ Inject (talk | contribs)‎ . . (3,102 bytes) (+30)‎ . . (→‎Utilizing devices) (undo)
(cur | prev) 06:36, 6 September 2017‎ Inject (talk | contribs)‎ . . (3,072 bytes) (+27)‎ . . (→‎Utilizing devices) (undo)
(cur | prev) 06:32, 6 September 2017‎ Inject (talk | contribs)‎ . . (3,045 bytes) (+42)‎ . . (→‎Utilizing devices) (undo)
(cur | prev) 06:31, 6 September 2017‎ Inject (talk | contribs)‎ . . (3,003 bytes) (+17)‎ . . (→‎Utilizing devices) (undo)
(cur | prev) 06:26, 6 September 2017‎ Inject (talk | contribs)‎ . . (2,986 bytes) (0)‎ . . (undo)
(cur | prev) 06:25, 6 September 2017‎ Inject (talk | contribs)‎ . . (2,986 bytes) (+972)‎ . . (undo)
(cur | prev) 06:07, 6 September 2017‎ Inject (talk | contribs)‎ . . (2,014 bytes) (+586)‎ . . (undo)
(cur | prev) 05:56, 6 September 2017‎ Inject (talk | contribs)‎ . . (1,428 bytes) (+196)‎ . . (undo)
(cur | prev) 05:14, 6 September 2017‎ Inject (talk | contribs)‎ . . (1,232 bytes) (+344)‎ . . (undo)
(cur | prev) 04:39, 6 September 2017‎ Inject (talk | contribs)‎ . . (888 bytes) (+370)‎ . . (undo)
(cur | prev) 04:17, 6 September 2017‎ Inject (talk | contribs)‎ . . (518 bytes) (+486)‎ . . (undo)
(cur | prev) 01:58, 6 September 2017‎ Inject (talk | contribs)‎ . . (32 bytes) (+32)‎ . . (Created page with "{{hisilicon title|K3V2}} {{mpu}}")

Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	K3V2 - HiSilicon#package +
base frequency	1,500 MHz (1.5 GHz, 1,500,000 kHz) +
core count	4 +
core name	Cortex-A9 +
designer	HiSilicon + and ARM Holdings +
family	K3 +
first announced	February 26, 2012 +
first launched	February 26, 2012 +
full page name	hisilicon/k3/k3v2 +
has ecc memory support	false +
instance of	microprocessor +
integrated gpu	GC4000 +
integrated gpu base frequency	480 MHz (0.48 GHz, 480,000 KHz) +
integrated gpu designer	Vivante +
integrated gpu execution units	16 +
isa	ARMv7 +
isa family	ARM +
l1$ size	256 KiB (262,144 B, 0.25 MiB) +
l1d$ description	4-way set associative +
l1d$ size	128 KiB (131,072 B, 0.125 MiB) +
l1i$ description	4-way set associative +
l1i$ size	128 KiB (131,072 B, 0.125 MiB) +
l2$ description	8-way set associative +
l2$ size	1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
ldate	February 26, 2012 +
main image	+
manufacturer	TSMC +
market segment	Mobile +
max cpu count	1 +
max memory bandwidth	6.71 GiB/s (6,871.04 MiB/s, 7.205 GB/s, 7,204.808 MB/s, 0.00655 TiB/s, 0.0072 TB/s) +
max memory channels	2 +
microarchitecture	Cortex-A9 +
model number	K3V2 +
name	K3V2 +
package	TFBGA-576 +
part number	Hi3620 +
process	40 nm (0.04 μm, 4.0e-5 mm) +
smp max ways	1 +
supported memory type	LPDDR2-900 +
technology	CMOS +
thread count	4 +
transistor count	600,000,000 +
used by	Huawei Ascend D1 Quad XL +, Huawei Ascend D2 +, Huawei Ascend G330D +, Huawei Ascend G350 +, Huawei Ascend G700 +, Huawei Ascend G716 +, Huawei Ascend Mate 2 +, Huawei Ascend P1 +, Huawei Ascend P2 +, Huawei Ascend P6 +, Huawei Ascend P6S +, Huawei Ascend W1 +, Huawei Ascend Y201 +, Huawei Ascend Y300 +, Huawei Honor 2 +, Huawei Honor 3 +, Huawei Honor + +, Huawei MediaPad 10 FHD +, Huawei MediaPad 10 Link +, Huawei MediaPad 7 Lite +, Huawei MediaPad 7 Vogue +, Huawei MediaPad 7 Youth +, Huawei STREAM X GL07S +, Lexand A802 + and Huawei MediaQ M310 +
word size	32 bit (4 octets, 8 nibbles) +

WikiChip

The Fuse Coverage

Social Media

Companies

Microarchitectures

Technology Nodes

Intel

AMD

ARM

Cavium

Samsung

Intel

AMD

Ampere

Apple

Cavium

HiSilicon

MediaTek

NXP

Qualcomm

Renesas

Samsung