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Kunpeng 920
General Info
Designer	HiSilicon, ARM Holdings
Manufacturer	TSMC
Model Number	Hi1620
Part Number	Hi1620
Market	Server
Introduction	September, 2018 (announced) January 7, 2019 (launched)
General Specs
Family	Hi16xx
Series	Kunpeng 920
Frequency	2,400 MHz, 2,600 MHz, 3,000 MHz
Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Custom
Technology	CMOS
Word Size	64 bit
Cores	64
Threads	64
Max Memory	512 GiB
Multiprocessing
Max SMP	4-Way (Multiprocessor)

Hi1620 on exhibit.

Kunpeng 920 (Hi1620) is a planned octatetraconta-core 64-bit ARM server microprocessor set to be introduced by HiSilicon in late-2018. Fabricated by TSMC on a 7 nm process, this chip incorporates 64 custom cores operating at 2.4-3 GHz with a TDP of up to 200 W. The Hi1620 supports up to 1 TiB of octa-channel DDR4-3200 memory.

Preliminary Data! Information presented in this article deal with a microprocessor or chip that was recently announced or leaked, thus missing information regarding its features and exact specification. Information may be incomplete and can change by final release.

Cache

Main article: Ares § Cache

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 8 MiB 8,192 KiB 8,388,608 B L1I$ 4 MiB 4,096 KiB 4,194,304 B 64x64 KiB     L1D$ 4 MiB 4,096 KiB 4,194,304 B 64x64 KiB     L2$ 32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB     64x512 KiB     L3$ 64 MiB 65,536 KiB 67,108,864 B 0.0625 GiB     64x1 MiB

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type DDR4-3200 Supports ECC Yes Max Mem 1 TiB Controllers 1 Channels 8 Width 64 bit Max Bandwidth 190.7 GiB/s 195,276.8 MiB/s 204.763 GB/s 204,762.566 MB/s 0.186 TiB/s 0.205 TB/s Bandwidth Single 23.84 GiB/s Double 47.68 GiB/s Quad 95.37 GiB/s Octa 190.7 GiB/s

Expansions

[Edit/Modify Expansions Info]

	Expansion Options
PCIe Revision: 3.0 Max Lanes: 40 Configuration: x16, x8, x4 USB Revision: 3.0 Max Ports: 4 SATA Revision: 3.0 Max Ports: 2

Features

[Edit/Modify Supported Features]

	Supported ARM Extensions & Processor Features
	NEON Advanced SIMD extension CRC32 CRC-32 checksum Extension

Utilizing devices

• HiSilicon D06

This list is incomplete; you can help by expanding it.

Bibliography

• Huawei. (January 7, 2018). [press release] "Huawei Unveils Industry's Highest-Performance ARM-based CPU Bringing Global Computing Power to Next Level".