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Pixel Visual Core (PVC) - Google
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Pixel Visual Core
General Info
DesignerGoogle
ManufacturerTSMC
Part NumberX726C502
S-SpecSR3HX
MarketMobile, Embedded
IntroductionOctober 17, 2017 (announced)
October 17, 2017 (launched)
Microarchitecture
ISAvISA, pISA
Process28 nm
TechnologyCMOS
Electrical
TDP8 W

Pixel Visual Core (PVC) is an advanced image processing unit custom designed by Google introduced in late 2017 for their Pixel 2 smartphone and future IoT applications. Designed by Google and fabricated by TSMC on their 28HPM process, the IPU is a fully-programmable domain-specific processor designed from the ground-up in order to deliver the highest performance at low power.

Overview

The pixel visual core is designed as a co-processor for various consumer products. Although it's currently only used in the Pixel 2 smartphone, Google have plans to use it in other IoT products in the future. The chip itself incorporates a dedicate ARM Cortex-A53 core which handles the application-level resource requests and configures the core to handle the specific workload. For example, if the application sends a request to capture an image using HDR+, the management core will reconfigure the processing units such that an image captured by the camera will get processed and transformed into HDR+ format. The PVC is optimized for high performance by racing to sleep with a power budget of 6-8 W for very short bursts for around 10-20 seconds an dropping back down to milliwatt when idle. The chip relies equally on both hardware and software in order to achieve the high performance and efficiency by using TensorFlow for machine learning and Halide for image processing.

Die

Floorplan

google pvc floorplan.png

Die

  • TSMC 28nm 28HPM process
google pvc die.png
designerGoogle +
first announcedOctober 17, 2017 +
first launchedOctober 17, 2017 +
full page namegoogle/pixel visual core +
isavISA + and pISA +
ldateOctober 17, 2017 +
manufacturerTSMC +
market segmentMobile + and Embedded +
namePixel Visual Core +
part numberX726C502 +
process28 nm (0.028 μm, 2.8e-5 mm) +
s-specSR3HX +
tdp8 W (8,000 mW, 0.0107 hp, 0.008 kW) +
technologyCMOS +