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== Die size == | == Die size == | ||
+ | {{main|die size}} | ||
Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single [[wafer]], the die size is a strong indicator of cost. | Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single [[wafer]], the die size is a strong indicator of cost. | ||
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|- style="vertical-align: top;" | |- style="vertical-align: top;" | ||
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+ | * 826 mm² (GA100) | ||
* 815 mm² (GV100) | * 815 mm² (GV100) | ||
* 754 mm² (TU102) | * 754 mm² (TU102) | ||
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* 246 mm² (BDW LCC) | * 246 mm² (BDW LCC) | ||
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− | * 2x 74 mm² + 1x 125 mm² (Matisse) | + | * 2x 74 mm² + 1x 125 mm² ({{amd|Matisse|l=core}}) |
− | * 213 mm² (Pinnacle Ridge) | + | * 213 mm² ({{amd|Pinnacle Ridge|l=core}}) |
− | * 213 mm² (Summit Ridge) | + | * 213 mm² ({{amd|Summit Ridge|l=core}}) |
− | * 210 mm² (Picasso) | + | * 210 mm² ({{amd|Picasso|l=core}}) |
− | * 210 mm² (Raven Ridge) | + | * 210 mm² ({{amd|Raven Ridge|l=core}}) |
− | * 199 mm² (Comet Lake 10C) | + | * 199 mm² ({{intel|Comet Lake S|Comet Lake 10C|l=core}}) |
− | * 174 mm² (Coffee Lake 8C) | + | * 174 mm² ({{intel|Comet Lake S|Coffee Lake 8C|l=core}}) |
− | * 156 mm² (Renoir) | + | * 156 mm² ({{amd|Renoir|l=core}}) |
− | * 150 mm² (Coffee Lake 6C) | + | * 150 mm² ({{intel|Comet Lake S|Coffee Lake 6C|l=core}}) |
− | * 123 mm² (Ice Lake 4C) | + | * 123 mm² ({{intel|Ice Lake U|Ice Lake 4C|l=core}}) |
− | * 122 mm² (Skylake 4C) | + | * 122 mm² ({{intel|Skylake S|Skylake 4C|l=core}}) |
− | * 102 mm² (Skylake 2C) | + | * 102 mm² ({{intel|Skylake U|Skylake 2C|l=core}}) |
| | | | ||
* 163 mm² (A5X) | * 163 mm² (A5X) |
Revision as of 02:36, 1 June 2020
A die is the actual bare IC chip and is the final product of the fabrication process. It is the individual chip made following the singulation of a wafer. Dies typically undergo packaging before being sold to the customer as a final product.
Contents
Overview
The die is the final product of the fabrication process. A fully processed wafer will under singulation following probing. Depending on the application, the die may be shipped to an assembly/packaging plant where it will undergo encapsulation, producing the final chip that ships to customers.
Known good die
- Main article: Known Good Die (KGD)
A known good die is a special type of bare die that underwent additional testing and screening post-singulation. KGD testing ensures the die meets the required specification prior to getting packaged. KGDs are especially important in multi-chip packages where multiple dies in a single package must function correctly to produce the required product.
Die size
- Main article: die size
Die size refers to the length and width of the die. Since the die size and shape determines the total number of dies that may be realized from a single wafer, the die size is a strong indicator of cost.
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